A3PE600-1FGG484 vs A3PE600-FGG484 Comparação
Comparação detalhada lado a lado de A3PE600-1FGG484 por Microchip Technology e A3PE600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ AtivoMicrochip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE600-1FGG484 | A3PE600-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $44,90 | $53,70 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Cells / CLBs | 13824 | — |
| User I/Os (this package) | 270 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 110592 bits (504 kbits true dual-port max per family data) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm CMOS flash |
| Configuration Memory | On-chip flash, live at power-up (Level 0) | On-chip flash (non-volatile, live at power-up) |
| Speed Grade | -1 | — |
| Temperatura de operação | 0 C to +85 C (TJ) | — |
| Encapsulamento | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch | FBGA-484 (PBGA484) |
| Tipo de montagem | Surface Mount | — |
| Packaging | Tray | — |
| Status RoHS | ROHS3 Compliant | Green / [DATA_NEEDED: RoHS compliance detail] |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Reprogrammability | Yes, single-chip solution, no external boot device | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Maximum System Frequency | — | 350 MHz |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Estilo de montagem | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |