A3PE600L-FGG484M vs A3PE600-FG484 Comparação
Comparação detalhada lado a lado de A3PE600L-FGG484M por Microchip Technology e A3PE600-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE600L-FGG484M - ProASIC3EL Flash FPGA 600K | Microchip
A3PE600L-FGG484M ✓ AtivoMicrochip Technology
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE600L-FGG484M | A3PE600-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $79,90 | $59,00 |
| Family | ProASIC3EL | ProASIC3E (Flash FPGA) |
| Logic Elements | 7K (per distributor listing) | — |
| System Gates | 600K | 600000 |
| User I/O | 270 | — |
| User Flash Memory | 110592 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS flash | — |
| Configuration Memory | On-chip Flash (nonvolatile, reprogrammable) | — |
| Encapsulamento | 484-Ball FBGA (484-BGA) | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Speed Grade | [DATA_NEEDED: speed grade] | — |
| Flash*Freeze Technology | Supported (ProASIC3/EL military datasheet) | — |
| Neutron-Induced Configuration Loss | Not susceptible (per datasheet) | — |
| Device Screening | Each device tested from -55C to 125C (per datasheet) | — |
| Programming Tool | Microchip Libero SoC | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Cells (CLBs) | — | 13824 |
| User I/Os | — | 270 |
| Embedded Memory | — | 110592 |
| Maximum System Frequency | — | 231 MHz |
| Technology | — | 130 nm CMOS flash |
| Package Height | — | 2.23 mm |
| Configuration | — | Nonvolatile flash (single-chip, no external configuration PROM) |
| Package Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Soft Processor Support | — | Soft ARM support |
| Packaging | — | Tray |