AFS600-FG256I vs M1AFS600-2FG256 Comparação
Comparação detalhada lado a lado de AFS600-FG256I por Microchip Technology e M1AFS600-2FG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ AtivoMicrochip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ AtivoComparação de especificações
| Parâmetro | AFS600-FG256I | M1AFS600-2FG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 gates |
| Configurable Logic Blocks | 13,824 CLBs | — |
| User I/O | 119 I/O | — |
| Tensão de alimentação | 1.5 V | — |
| Process Technology | 130 nm CMOS | — |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash memory | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Logic Family | CMOS | — |
| Package Type | 256-LBGA | — |
| Package Pitch | 1.0 mm | — |
| Number of Package Balls | 256 balls | — |
| Package Shape | Square | — |
| Tipo de montagem | Surface mount | — |
| Temperatura de operação | 0 C to 70 C | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Series | — | M1AFS600 (Fusion) |
| Logic Elements | — | 110592 |
| Embedded Processor | — | ARM Cortex-M1 |
| Number of I/Os | — | 119 I/O |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm flash-based |
| Encapsulamento / Caixa | — | 256-LBGA (FBGA-256) |
| Estilo de montagem | — | SMD/SMT |
| Operating Temperature - Minimum | — | 0 C |
| Operating Temperature - Maximum | — | +70 C |
| Packaging | — | Tray |
| Analog Peripherals | — | Configurable analog block (Fusion mixed-signal) |
| On-chip Memory | — | Large flash memory blocks |
| Clock Management | — | On-chip clock generation and management (PLL) |
| Configuration | — | Flash-based, live at power-up, no external config PROM required |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum fabric operating frequency] |