DSP56301VF100 vs DSP56303AG100 Comparação
Comparação detalhada lado a lado de DSP56301VF100 por NXP Semiconductors e DSP56303AG100 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
DSP56301VF100 - 100MHz 24-bit Fixed-Point DSP, 252-MAPBGA | NXP
DSP56301VF100 ObsoleteNXP Semiconductors
DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
DSP56303AG100 ✗ Fim de vidaComparação de especificações
| Parâmetro | DSP56301VF100 | DSP56303AG100 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | Obsolete | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $16,95 | $18,90 |
| Type | Fixed-Point Digital Signal Processor | — |
| Family | DSP56300 (DSP563XX series) | — |
| Core Clock Speed | 100 MHz | — |
| Instruction Throughput | 100 MIPS / 100 MMACS | — |
| Data Word Width | 24 bits (parallel X and Y data paths) | 24-bit (56-bit accumulator) |
| On-Chip RAM | 24 kB | — |
| On-Chip ROM (Non-Volatile) | 9 kB | — |
| I/O Voltage | 3.30 V | 3.3 V |
| Host Interface | Yes | — |
| Serial Interfaces | SSI (Synchronous Serial Interface), SCI (Serial Communication Interface) | 2x ESSI, 1x SCI, 1x HI08 (Host) |
| Timers | Triple Timer block | Triple Timer module (3x 16-bit) |
| Encapsulamento / Caixa | 252-MAPBGA (21 x 21 mm) | — |
| Packaging | Tray | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Instruction Word Width | — | 24-bit |
| Operating Frequency | — | 100 MHz (100 MIPS) |
| On-Chip Program/Data RAM | — | 24 KB |
| On-Chip X/Y Data RAM | — | 24 KB |
| Boot ROM | — | 576 bytes |
| Core Voltage | — | 1.8 V |
| Encapsulamento | — | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm |
| External Memory Bus | — | 24-bit address / 24-bit data, 16-bit external data bus expansion |
| Address Generation | — | 24-bit ALU with bit-reversed addressing for FFT |
| Faixa de temperatura de operação | — | -40C to +85C (industrial) |
| Nível MSL | — | [DATA_NEEDED: MSL level] |