EP1AGX35DF780 vs EP1AGX35DF780I6 Comparação
Comparação detalhada lado a lado de EP1AGX35DF780 por Altera e EP1AGX35DF780I6 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP1AGX35DF780 | EP1AGX35DF780I6 |
|---|---|---|
| Marca | Altera | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $142,60 | $175,00 |
| Series | Arria GX | Arria GX |
| Family | Altera Arria GX (90 nm) | Arria GX |
| Logic Elements (LE) | 33,520 | — |
| Embedded Memory | 1,348,416 bits (1.34 Mbit) | — |
| Maximum User I/Os | 341 | — |
| Number of LABs / CLBs | 1676 LABs | — |
| Transceivers | Up to 8 channels, 3.125 Gbps per channel | — |
| PLLs | 4 | — |
| Embedded Multipliers | 18x18-bit hard multipliers (DSP blocks) | — |
| External Memory Support | DDR, DDR2, QDRII, QDRII+ | — |
| Encapsulamento | 780-ball FineLine BGA (FCBGA, 29x29 mm) | — |
| Configuration Methods | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG 1149.1 | — |
| Faixa de temperatura de operação | -40C to +85C (industrial grade I-suffix variants available) | — |
| Process Node | 90 nm CMOS | — |
| Status RoHS | Compliant (lead-free variant) | Contains lead / RoHS non-compliant (per third-party distributor) |
| Lifecycle | Mature / Obsolete in Intel FPGA product tree | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| Logic Elements / Cells | — | 33,520 |
| Number of LABs/CLBs | — | 1676 |
| Number of Logic Elements | — | 33,520 |
| Total RAM Bits | — | [DATA_NEEDED: total embedded memory bits] |
| Number of I/O | — | 341 |
| Number of Transceivers | — | Up to 4 channels |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| Voltage - Supply (Core) | — | 1.2 V |
| Temperatura de operação | — | -40C to +100C (industrial, I6 speed grade) |
| Tipo de montagem | — | Surface Mount |
| Encapsulamento / Caixa | — | 780-BGA, FC-FBGA |
| Package Size | — | 29 mm x 29 mm, 1.0 mm pitch |
| Process Technology | — | 90 nm |
| Maximum Internal Frequency | — | 640 MHz |
| Speed Grade | — | I6 (industrial) |
| Lead Free Status | — | Contains lead |