EP20K400FC784-2 vs EP20K400CFC672-9 Comparação
Comparação detalhada lado a lado de EP20K400FC784-2 por Altera e EP20K400CFC672-9 por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP20K400FC784-2 | EP20K400CFC672-9 |
|---|---|---|
| Marca | Altera | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $175,00 | $325,00 |
| Family | APEX 20K | APEX-20KC |
| Device Family Member | EP20K400C | — |
| Typical System Gates | 400,000 | — |
| Maximum User I/O Pins | 488 (784-BGA) | — |
| Logic Elements | 16,640 | — |
| Embedded RAM (ESB) | 212 Kbits | — |
| Maximum Block RAM | [DATA_NEEDED: block RAM organization per ESB] | — |
| Maximum Frequency (internal) | [DATA_NEEDED: fmax, datasheet-dependent] | — |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Core Voltage | 2.5 V | — |
| MultiVolt I/O Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Supported I/O Standards | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT | — |
| Configuration Mode | Serial / Parallel SRAM-volatile (external PROM required) | — |
| Encapsulamento | 784-Ball FineLine BGA (FC) | 672-ball FineLine BGA (FCBGA) |
| Speed Grade | -2 (industrial) | -9 (commercial, slowest bin) |
| Temperatura de operação | [DATA_NEEDED: exact Tj range] | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Nível MSL | 3 (per Partstack listing) | — |
| Peak Reflow Temperature | 220 °C (per Partstack listing) | — |
| Hot Socketing | Supported | — |
| JTAG / Boundary-Scan | IEEE 1149.1 compliant | — |
| Status RoHS | [DATA_NEEDED: not confirmed in provided data] | [DATA_NEEDED: RoHS status] |
| Logic Elements / Macrocells | — | 1664 |
| Typical Gate Count | — | 400,000 gates |
| Embedded Memory (ESB) | — | 212,992 bits |
| User I/O Count | — | 488 |
| PLLs | — | 4 |
| Core Supply Voltage | — | 1.71 V to 1.89 V |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature (TJ) | — | 0 °C to 85 °C |
| Package Body Size | — | 27 mm × 27 mm |
| Configuration Method | — | EPC serial device or JTAG |
| Process Node | — | [DATA_NEEDED: process node] |