EP20K600CF672C8N vs EP20K600CF672C8 Comparação
Comparação detalhada lado a lado de EP20K600CF672C8N por Intel e EP20K600CF672C8 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP20K600CF672C8N | EP20K600CF672C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Unknown |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $108,00 | $322,41 |
| Device Type | SPLD | Field Programmable Gate Array (FPGA) |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | 508 |
| Package Terminals | 652 pins | — |
| Encapsulamento | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Tensão de alimentação | 1.8 V | 1.71 V to 1.89 V |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns |
| Fabrication Process | 0.15 µm | 0.15 um |
| Temperatura de operação | 0°C to 85°C | 0 C to 85 C |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Tipo de montagem | Surface mount | Surface Mount |
| Status RoHS | unknown | Non-compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Resistência térmica | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20K |
| Logic Elements | — | 24,320 |
| Total RAM Bits | — | 311,296 bits |
| Package Pin Count | — | 672 balls |
| Supplier Device Package | — | 672-FBGA, 27 mm x 27 mm |
| Alternate Package Description | — | BGA-652, 45 mm x 45 mm, 1.27 mm pitch |
| Package Type | — | FBGA |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency] |