EP2AGX260EF29I5N vs EP2AGX260EF29I3N Comparação
Comparação detalhada lado a lado de EP2AGX260EF29I5N por Intel e EP2AGX260EF29I3N por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Altera
EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
EP2AGX260EF29I3N NrndComparação de especificações
| Parâmetro | EP2AGX260EF29I5N | EP2AGX260EF29I3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.950,00 | $2.120,00 |
| Series | Arria II GX | Arria II GX |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | 372 |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | — |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | Compliant |
| Process Technology | CMOS | 40 nm |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 244,188 |
| Logic Array Blocks (LABs) | — | 10,260 |
| Embedded Memory | — | 12,038,144 bits |
| Total Block RAM | — | 8.7 Mbit (M20K blocks) |
| DSP Blocks / 18x18 Multipliers | — | [DATA_NEEDED: DSP block count] / 1,023 (max) |
| Transceiver Channels | — | 12 (up to 6.375 Gbps) |
| PLLs | — | 8 |
| Core Voltage | — | 0.9 V |
| Temperatura de operação | — | -40 °C to +100 °C (Industrial) |
| Encapsulamento | — | 780-ball FCBGA / 780-BBGA |
| Hard IP | — | PCIe Gen2 endpoint, DDR2/DDR3 PHY |