EP2AGZ300FF35C4N vs EP2AGZ300FF35I4G Comparação
Comparação detalhada lado a lado de EP2AGZ300FF35C4N por Altera e EP2AGZ300FF35I4G por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2AGZ300FF35C4N | EP2AGZ300FF35I4G |
|---|---|---|
| Marca | Altera | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.350,00 | $2.610,00 |
| Series | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Logic Array Blocks (LABs) | 11,920 | — |
| Embedded Memory (bits) | 18,854,912 (~17.9 Mbit) | — |
| User I/O Count | 554 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Package Type | 1152-BBGA, FCBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Package Code (JEDEC) | HBGA | — |
| Operating Temperature Grade | Commercial (C4 = 0C to +85C) | — |
| Configuration Memory | SRAM-based (volatile, requires boot device) | — |
| Transceivers | Multi-gigabit transceivers integrated | Up to 21 channels |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks] | [DATA_NEEDED: DSP block count] |
| PLLs | [DATA_NEEDED: PLL count] | Fractional PLLs on-chip |
| Status RoHS | Compliant (per Besenchips / DigiKey listing) | Compliant |
| Lead-Free Status | Lead free (per Besenchips listing) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Maximum Operating Frequency | 500 MHz | — |
| Family Name | — | Arria II GZ FPGA |
| Logic Elements (LE) | — | 300,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Bits) | — | 18.16 Mbit |
| Maximum User I/O | — | 554 |
| Transceiver Data Rate | — | 8.55 Gbps |
| Hard PCIe Controllers | — | PCIe Gen1 and Gen2 |
| Memory Interfaces | — | DDR3, DDR2, QDRII+, QDRII SRAM up to 800 MHz |
| Encapsulamento | — | 1152-FBGA (FF35) 35x35 mm |
| Temperatura de operação | — | -40C to +100C (Industrial, I4 grade) |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |
| Process Node | — | 40 nm |
| Speed Grade | — | 4 |