EP2SGX30CF780C3N vs EP2SGX30CF780C5N Comparação
Comparação detalhada lado a lado de EP2SGX30CF780C3N por Intel e EP2SGX30CF780C5N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2SGX30CF780C3N | EP2SGX30CF780C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $195,00 | $160,00 |
| Series | Stratix II GX | — |
| Number of Logic Elements | 33,880 | — |
| Number of CLBs | 33,880 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Número de pinos | 780 | — |
| Package Type | 780-BGA (FC-FBGA) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | 0C to +85C (commercial) | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family datasheet] | — |
| Embedded Memory | TriMatrix (M512/M4K/M-RAM blocks) | — |
| Total Embedded RAM | ~1.4 Mbit | — |
| DSP Blocks | 18-bit x 18-bit dedicated multipliers | — |
| Configuration Modes | PS, FPP, JTAG | — |
| Number of User I/O | [DATA_NEEDED: pin count varies by package; ~600 typical for 780-BGA] | — |
| Status RoHS | [DATA_NEEDED: not stated in retrieved web snippets] | Compliant (per Intel product page) |
| Lead-Free | [DATA_NEEDED: not stated in retrieved web snippets] | Yes (per datasheet) |
| Supply Voltage Range | [DATA_NEEDED: full VTT/VCCIO not stated in retrieved web snippets] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Family | — | Stratix II GX |
| Logic Elements | — | 30,560 (33,880 logic cells) |
| LABs/CLBs | — | 1694 |
| Total RAM Bits | — | 1,369,728 bits |
| Number of I/Os | — | 361 |
| Operating Frequency (max) | — | 609.76 MHz |
| Speed Grade | — | C5 (-5 internal speed bin) |
| Encapsulamento | — | FBGA-780 (29 x 29 mm, 1.0 mm pitch) |
| JEDEC Package Outline | — | MS-034AAM-1 |