EP2SGX60EF1152C3N vs EP2SGX60EF1152I4N Comparação
Comparação detalhada lado a lado de EP2SGX60EF1152C3N por Intel e EP2SGX60EF1152I4N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP2SGX60EF1152C3N | EP2SGX60EF1152I4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2.195,00 | $0,00 |
| Family | Stratix II GX | — |
| Series | Stratix II | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| Encapsulamento | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1,152-ball FBGA |
| Speed Grade | C3 (commercial, -3 bin) | — |
| Temperatura de operação | 0C to +85C (commercial) | — |
| Tipo de montagem | Surface Mount (BGA) | Surface mount |
| Device Type | — | FPGA |
| Product Family | — | Stratix II GX |
| Logic Cells | — | 60,440 |
| Embedded Memory | — | 2,544,192 bits |
| I/O Count | — | 534 |
| Internal Frequency | — | 717 MHz |
| Tensão de alimentação | — | 1.2 V |
| Package Type | — | Other, 23 x 23 mm, 1 mm pitch, MS-034AAJ-1, FBGA-484 |
| Pins | — | 484 |
| Device Technology | — | 90 nm |
| Logic Blocks | — | 3,022 LABs |
| Operating Temperature Grade | — | Industrial |
| Compliance | — | [DATA_NEEDED: compliance certification details] |
| Transceiver Count | — | [DATA_NEEDED: high-speed transceiver count] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory specification] |
| Package Pinout | — | [DATA_NEEDED: complete ball-map pinout] |