EP2SGX90F1508C3 vs EP2SGX90FF1508C3ES Comparação
Comparação detalhada lado a lado de EP2SGX90F1508C3 por Altera e EP2SGX90FF1508C3ES por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Altera
EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel
EP2SGX90F1508C3 ObsoleteIntel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES ObsoleteComparação de especificações
| Parâmetro | EP2SGX90F1508C3 | EP2SGX90FF1508C3ES |
|---|---|---|
| Marca | Altera | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.350,00 | $1.340,00 |
| Family | Stratix II GX | Stratix II GX |
| Number of Logic Elements | 90,960 | — |
| Number of LABs/CLBs | 4,544 | — |
| Total RAM Bits | 4,520,448 (approx. 4.5 Mbit) | 4,520,448 |
| Number of I/O | 650 | — |
| Voltage - Supply | 1.2 V core | — |
| Temperatura de operação | 0C to +85C (C3 commercial grade) | — |
| Encapsulamento / Caixa | 1508-BBGA, FCBGA (FC-FBGA-1508) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Number of Transceivers | 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| Embedded Multipliers (18x18) | 252 | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Status RoHS | [DATA_NEEDED: RoHS compliance per Altera datasheet] | [DATA_NEEDED: rohs] |
| Configuration Method | JTAG, EPCS, EPCQ serial flash, Fast Passive Parallel | — |
| Logic Elements | — | 90,960 |
| Logic Array Blocks (LABs) | — | 4,828 |
| Embedded Memory (TriMatrix) | — | 4,520,448 bits |
| Core Supply Voltage | — | 1.2 V |
| Maximum Internal Frequency | — | 816.9 MHz |
| DSP Blocks | — | Yes (dedicated multiplier blocks) |
| Embedded Transceivers | — | Up to 3.125 Gbps multi-gigabit transceivers |
| Global Clock Networks | — | Up to 16 |
| Regional Clock Networks | — | Up to 32 per device region |
| Encapsulamento | — | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch |
| Configuration Interface | — | JTAG / EPCS serial flash / Passive parallel |
| Operating Temperature Grade | — | Commercial / Industrial (per part suffix) |