EP3CLS100F484C8N vs EP3CLS100F484C7N Comparação
Comparação detalhada lado a lado de EP3CLS100F484C8N por Intel e EP3CLS100F484C7N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3CLS100F484C8N | EP3CLS100F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $115,40 | $495,80 |
| Series | Cyclone® III LS | — |
| Family Name | Cyclone III LS | — |
| Logic Elements | 100,448 | 100,448 |
| Embedded Memory Bits | 4,451,328 bits | — |
| Number of I/O | 278 (maximum user I/O) | — |
| Number of Logic Blocks / Cells | 47 (logic blocks reported by DigChip snapshot) | — |
| Package Type | FBGA-484 (FineLine BGA, lead-free) | — |
| Pin / Ball Count | 484 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Speed Grade | C8 (commercial, fastest) | C7 |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm low-power (TSMC) |
| Temperatura de operação | 0°C to +85°C (commercial grade) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Configuration Interface | JTAG, Passive Serial, Active Serial | — |
| Bitstream Encryption | AES-128 (Cyclone III LS security feature) | — |
| Status RoHS | Compliant (Pb-free, 'N' suffix) | Compliant (lead-free, N suffix) |
| Nível MSL | 3 (per JEDEC J-STD-020, typical for BGA) | — |
| Embedded Multipliers (18x18) | 4,488 (per Cyclone III LS family handbook, 100K LE tier) | — |
| PLLs | 4 (per Cyclone III LS family) | 4 |
| DSP Blocks | Integrated (multiplier-based) | — |
| Family | — | Cyclone III LS |
| Embedded Memory (bits) | — | 4,451,328 |
| User I/O Pins | — | 278 |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature (junction) | — | 0°C to +85°C (commercial) |
| Encapsulamento | — | 484-ball FineLine BGA (FBGA-484) |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions] |
| Configuration Method | — | SRAM-based (volatile), via EPCS/JTAG/parallel flash |
| Security Features | — | Bitstream encryption, JTAG tamper protection |
| Design Software | — | Quartus II / Intel Quartus Prime |