EP3SE50F484C2G vs EP3SE50F484C3N Comparação
Comparação detalhada lado a lado de EP3SE50F484C2G por Intel e EP3SE50F484C3N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP3SE50F484C2G | EP3SE50F484C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Última compra | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.180,00 | $832,10 |
| Series | Stratix III E | — |
| Number of Logic Elements / Cells | 47,500 | — |
| Number of LABs / CLBs | 1,900 | — |
| Total RAM Bits | 5,760,000 (5,760 Kbit) | — |
| Number of User I/O | 296 | — |
| Encapsulamento / Caixa | 484-BBGA, FCBGA (FineLine BGA) | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Core Voltage Supply | 0.86 V to 1.15 V | — |
| Temperatura de operação | 0 °C to +85 °C (TJ) | 0C to +85 C (commercial, C suffix) |
| Process Technology | 40 nm TSMC low-power CMOS | TSMC 40 nm low-power CMOS |
| Logic Element Architecture | Adaptive Logic Module (ALM) with 8-input fracturable LUT | — |
| Embedded DSP Blocks | Yes (variable-precision multipliers) | — |
| Transceivers | Multi-gigabit transceivers (selected package pins) | — |
| Memory Interface Support | DDR / DDR2 / DDR3 with hard PHY | — |
| Partial Reconfiguration | Supported | — |
| Configuration Interface | JTAG, Passive Serial, Fast Passive Parallel | — |
| Part Status | Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy | — |
| Status RoHS | Compliant | Lead-free (per DigiKey listing) |
| Family | — | Stratix III E |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| User I/Os | — | 296 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Encapsulamento | — | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Tensão de alimentação | — | Core and I/O voltages per Stratix III E datasheet |
| Nível MSL | — | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| Status do ciclo de vida | — | Obsolete (per Worldway listing 2026-04-05) |