EPF10K100EFC256-2X vs EPF10K100EFC256-2 Comparação
Comparação detalhada lado a lado de EPF10K100EFC256-2X por Altera e EPF10K100EFC256-2 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Altera
EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
EPF10K100EFC256-2X ObsoleteIntel
EPF10K100EFC256-2 - FLEX 10KE FPGA, 100K Gates, 256-BGA | Intel / Altera
EPF10K100EFC256-2 NrndComparação de especificações
| Parâmetro | EPF10K100EFC256-2X | EPF10K100EFC256-2 |
|---|---|---|
| Marca | Altera | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Obsolete | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $30,50 | $165,00 |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX 10KE | — |
| Logic Elements / Cells | 49,152 | 4,992 (49,152 user logic elements) |
| Number of LABs/CLBs | 624 | — |
| Number of Logic Elements/Cells | 4,992 | — |
| Total RAM Bits | 49,152 | [DATA_NEEDED: total EAB RAM bits] |
| Number of I/O | 191 | — |
| Number of Gates | 100,000 | 100,000 equivalent |
| Voltage - Supply | 2.375V to 2.625V (core), 3.0V to 3.6V (I/O) | — |
| Tipo de montagem | Surface Mount | Surface Mount (BGA) |
| Temperatura de operação | 0°C to 70°C | 0 °C to +70 °C (Commercial) |
| Encapsulamento / Caixa | 256-FBGA (FineLine BGA, 17x17 mm) | — |
| Supplier Device Package | 256-BGA | — |
| Speed Grade | -2 | — |
| Logic Family | CMOS (SRAM-based) | CMOS (SRAM-based) |
| Propagation Delay | 0.6 ns (per EAB) | — |
| Configuration Interface | JTAG / Passive Serial / Active Serial | — |
| Lead-Free / RoHS Status | Depends on date code - verify with distributor | — |
| Nível MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Number of LABs | — | 624 |
| User I/Os | — | 191 |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V |
| Propagation Delay (per LUT) | — | ~0.6 ns (speed grade -2) |
| Encapsulamento | — | 256-FBGA (FineLine BGA, 17 x 17 mm) |
| Configuration Method | — | PS, JTAG, in-system programmable |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Embedded Array Blocks | — | Yes (EAB for RAM/ROM/DSP) |