LSM6DSOTR vs LSM6DSRTR Comparação
Comparação detalhada lado a lado de LSM6DSOTR por STMicroelectronics e LSM6DSRTR por STMicroelectronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
STMicroelectronics
LSM6DSOTR - 6-Axis IMU, ±16g Accel, ±2000dPS Gyro LGA-14 | STMicroelectronics
LSM6DSOTR ✓ AtivoComparação de especificações
| Parâmetro | LSM6DSOTR | LSM6DSRTR |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoria | Motion Sensors | Motion Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2,65 | $4,10 |
| Product Type | 6-Axis IMU (Accelerometer + Gyroscope) | — |
| Sensor Function | 3D accelerometer + 3D gyroscope | — |
| Accelerometer Full-Scale Range | ±2 / ±4 / ±8 / ±16 g | ±2/±4/±8/±16 g |
| Gyroscope Full-Scale Range | ±125 / ±250 / ±500 / ±1000 / ±2000 dps | ±125/±250/±500/±1000/±2000/±4000 dps |
| Data Output Resolution | 16-bit | — |
| Supply Voltage (VDD) | 1.71 V to 3.6 V | — |
| Supply Voltage (VDDIO) | 1.71 V to 3.6 V | — |
| Current Consumption (High-Performance Mode) | 0.55 mA | — |
| Communication Interface | I²C / SPI / MIPI I3C | — |
| Default I²C Address | 0x6A (strap to 0x6B) | — |
| Package Type | LGA-14 | — |
| Temperatura de operação | -40 °C to +85 °C | -40 C to +85 C |
| Embedded Features | Finite-State Machine, Machine-Learning Core, Temperature Sensor | — |
| Status RoHS | Compliant | Compliant |
| Tipo de montagem | Surface Mount | Surface Mount |
| Tipo de sensor | — | Accelerometer, Gyroscope, Temperature (6-axis IMU) |
| Output Interface | — | I2C, SPI, I3C |
| Accelerometer Noise Density | — | [DATA_NEEDED: accel noise density] |
| Gyroscope Noise Density | — | [DATA_NEEDED: gyro noise density] |
| Tensão de alimentação | — | 1.71 V to 3.6 V |
| Encapsulamento | — | LGA-14 (2.5 x 3.0 mm) |
| Nível MSL | — | [DATA_NEEDED: MSL level] |
| FIFO | — | Up to 4 kB (configurable) |
| On-chip Processing | — | MLC (Machine Learning Core), FSM, sensor hub |
| Shipping Packaging | — | Tape & Reel (TR suffix) |