M1AFS1500-1FGG256K vs M7AFS600-FGG256 Comparação
Comparação detalhada lado a lado de M1AFS1500-1FGG256K por Microchip Technology e M7AFS600-FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256K ✓ AtivoMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ AtivoComparação de especificações
| Parâmetro | M1AFS1500-1FGG256K | M7AFS600-FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $232,40 |
| Number of Gates | 1,500,000 system gates | — |
| Number of I/O | 119 | — |
| Total RAM Bits | 276480 | — |
| Embedded Processor | ARM Cortex-M1 | ARM CoreMP7 |
| Tensão de alimentação | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Max Frequency | 1282.05 MHz | — |
| Technology | 130 nm flash-based | — |
| Encapsulamento / Caixa | 256-LBGA (256-FBGA, 17x17 mm) | — |
| Supplier Device Package | 256-FPBGA (17x17) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -55C to +100C (TJ) | [DATA_NEEDED: Operating Temperature Range] |
| Family | Fusion Mixed-Signal FPGA | Fusion (M7AFS600) |
| Packaging | Tray | Tray |
| Programmable Type | In-System Programmable (flash-based, non-volatile) | — |
| Status RoHS | RoHS3 Compliant | [DATA_NEEDED: RoHS Status] |
| Lead Free Status | Lead Free | — |
| Manufacturer Lead Time | 16 weeks | — |
| Product Status | Active | — |
| System Gates | — | 600K |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| Encapsulamento | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Nível MSL | — | [DATA_NEEDED: Moisture Sensitivity Level] |