M1AFS1500-2FG256 vs M1AFS1500-1FGG256K Comparação

Comparação detalhada lado a lado de M1AFS1500-2FG256 por Microchip Technology e M1AFS1500-1FGG256K por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS1500-2FG256 M1AFS1500-2FG256 - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-2FG256 - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip

M1AFS1500-2FG256 ✓ Ativo
Microchip Technology
M1AFS1500-1FGG256K M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256K ✓ Ativo

Comparação de especificações

Parâmetro M1AFS1500-2FG256 M1AFS1500-1FGG256K
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $280,68 $0,00
Family Fusion (AFS) Mixed-Signal FPGA, M1 (ARM Cortex-M1) variant Fusion Mixed-Signal FPGA
System Gates 1500000 —
Logic Cells 38400 —
User I/O 119 —
Configuration Memory 276480 bits (flash-based) —
Embedded Processor ARM Cortex-M1 ARM Cortex-M1
Core Supply Voltage 1.5 V —
Process Technology 130 nm CMOS flash —
Speed Grade -2 —
Encapsulamento 256-LBGA (FBGA, 256-ball) —
Tipo de montagem Surface Mount Surface Mount
Configuration Non-volatile flash, instant-on, JTAG programming —
Security 128-bit flash lock + AES decryption —
Analog Peripherals Configurable analog blocks (ADC, voltage/current monitors) —
Clock Management Integrated clock generation and management circuitry —
Temperatura de operação [DATA_NEEDED: Operating Temperature Range] -55C to +100C (TJ)
Status RoHS Lead free / RoHS Compliant RoHS3 Compliant
Number of Gates — 1,500,000 system gates
Number of I/O — 119
Total RAM Bits — 276480
Tensão de alimentação — 1.425 V to 1.575 V (1.5 V nominal)
Max Frequency — 1282.05 MHz
Technology — 130 nm flash-based
Encapsulamento / Caixa — 256-LBGA (256-FBGA, 17x17 mm)
Supplier Device Package — 256-FPBGA (17x17)
Packaging — Tray
Programmable Type — In-System Programmable (flash-based, non-volatile)
Lead Free Status — Lead Free
Manufacturer Lead Time — 16 weeks
Product Status — Active

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