M1AFS1500-2FG676I vs M1AFS1500-1FGG484 Comparação

Comparação detalhada lado a lado de M1AFS1500-2FG676I por Microchip Technology e M1AFS1500-1FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Ativo
Microchip Technology
M1AFS1500-1FGG484 M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 ✓ Ativo

Comparação de especificações

Parâmetro M1AFS1500-2FG676I M1AFS1500-1FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $405,00 $0,00
Family Fusion (Mixed-Signal Flash FPGA) Fusion Mixed-Signal FPGA (M1 series)
System Gates 1.5 M 1,500,000
Process Technology 130 nm CMOS 130 nm flash-based
Core Supply Voltage 1.5 V 1.5 V
Speed Grade 2 —
Encapsulamento 676-ball FBGA (FG676) 484-ball FBGA (FGG484)
Tipo de montagem Surface Mount Surface Mount
Configuration Memory On-chip flash (non-volatile, instant-on) Non-volatile on-chip flash
Faixa de temperatura de operação Industrial (I suffix) -40C to +100C —
Embedded Analog Features On-chip ADC, clock conditioning circuit (CCC), power-on reset —
External Configuration Device Not required —
Status RoHS RoHS Non-Compliant (contains lead) [DATA_NEEDED: RoHS status]
Lead Free Status Contains Lead —
Packaging Method Tray —
Number of User I/O [DATA_NEEDED: Number of User I/O] —
Embedded SRAM [DATA_NEEDED: Embedded SRAM capacity] —
DLL/PLL Blocks [DATA_NEEDED: Number of CCC blocks] —
Logic Cells — 38,400
User I/O — 223
Flash Memory — 276,480 bits
Embedded Processor — ARM Cortex-M1
Frequência máxima de clock — 350 MHz
Terminal Form — Ball (BGA), square package
Analog Blocks — Configurable analog (ADC, voltage/current monitors)
Clock Management — CCC with integrated PLLs
Temperatura de operação — [DATA_NEEDED: operating temperature range]
Packaging — Tray

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