M1AFS1500-FG676I vs M1AFS1500-1FG676I Comparação
Comparação detalhada lado a lado de M1AFS1500-FG676I por Microchip Technology e M1AFS1500-1FG676I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
M1AFS1500-FG676I ✓ AtivoMicrochip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ AtivoComparação de especificações
| Parâmetro | M1AFS1500-FG676I | M1AFS1500-1FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $425,73 | $340,59 |
| Family | Fusion (M1AFS1500) | — |
| System Gates | 1.5 M | — |
| Technology | 130 nm flash-based | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/O | 252 | — |
| Encapsulamento | 676-ball FBGA (FG676) | — |
| Tipo de montagem | Surface Mount | — |
| Configuration Type | Flash-based, non-volatile (no external config PROM) | — |
| Analog Blocks | Configurable analog subsystem (ADC, voltage/temp monitors) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) with PLL | — |
| On-chip Flash Memory | Large flash memory blocks integrated | — |
| Performance Figure | 1098.9 MHz (family-rated internal clock figure) | — |
| Temperature Grade | Industrial (-40C to +85C), suffix I | — |
| Packaging | Tray | Tray |
| Status RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant |
| Nível MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Manufacturer Part Number | — | M1AFS1500-1FG676I |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Product Type | — | Fusion Mixed-Signal FPGA |
| Number of Gates | — | 1.5 M |
| Number of I/O | — | 252 |
| Process Technology | — | 130 nm CMOS |
| Speed Grade | — | -1 |
| Encapsulamento / Caixa | — | 676-Pin FBGA |
| Estilo de montagem | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Nível de sensibilidade à umidade (MSL) | — | 3 (168 Hours) |
| Peak Reflow Time | — | 30 s |
| Lead Free Status | — | Contains Lead |