M1AFS600-FG484I vs M7AFS600-FGG484 Comparação

Comparação detalhada lado a lado de M1AFS600-FG484I por Microchip Technology e M7AFS600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS600-FG484I M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I - 600K Gates Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS600-FG484I ✓ Ativo
Microchip Technology
M7AFS600-FGG484 M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip

M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip

M7AFS600-FGG484 ✓ Ativo

Comparação de especificações

Parâmetro M1AFS600-FG484I M7AFS600-FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $232,90
Series Fusion (M1AFS600) —
Number of System Gates 600000 gates —
Logic Cells 13824 —
Number of I/Os 172 —
Memory Bits (DigiKey listing) 110592 bits —
Embedded Processor ARM Cortex-M1 ARM CoreMP7 (hard core)
Core Supply Voltage 1.5 V —
Process Technology 130 nm (CMOS flash-based) —
Frequency (per FindIC listing) 1098.9 MHz —
Encapsulamento / Caixa FBGA-484 (484-BGA), 1.0 mm pitch —
Estilo de montagem SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Security 128-bit flash lock, AES decryption —
Configuration Flash-based, live at power-up —
Packaging Tray Tray
Status RoHS Non-Compliant (contains lead, FG variant) Compliant (Pb-free balls, FGG suffix)
Lead Free Status Contains Lead —
Total RAM Blocks [DATA_NEEDED: total embedded RAM blocks] —
Analog Blocks [DATA_NEEDED: number of analog conditioning blocks] —
Family — Fusion (Mixed-Signal FPGA)
System Gates — 600 K
Technology — 130 nm flash-based
Core Voltage — 1.5 V
User I/O — 172
Maximum Operating Frequency — 1098.9 MHz (distributor-listed)
Configuration Memory — Flash (non-volatile, secure)
Encapsulamento — 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm
Ball Pitch — 1 mm
Tipo de montagem — Surface Mount
Temperatura de operação — [DATA_NEEDED: operating temperature range for commercial grade]
Total RAM Bits — 110592 (per DigiKey listing)
Number of Logic Blocks — [DATA_NEEDED: logic block count]

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação