M7AFS600-1FGG256I vs M7AFS600-FGG256I Comparação

Comparação detalhada lado a lado de M7AFS600-1FGG256I por Microchip Technology e M7AFS600-FGG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M7AFS600-1FGG256I M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I ✓ Ativo
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Ativo

Comparação de especificações

Parâmetro M7AFS600-1FGG256I M7AFS600-FGG256I
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $0,00
Family Fusion (Mixed-Signal Flash FPGA) Fusion Mixed-Signal FPGA
System Gates 600K 600K
Processor Core ARM CoreMP7 —
Number of I/O 119 —
Tensão de alimentação de operação 1.5 V —
Process Technology 130 nm, 7-layer metal flash-based CMOS 130 nm
Configuration Memory Flash (nonvolatile) —
System Performance Up to 350 MHz —
Speed Grade -1 —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Encapsulamento / Caixa 256-Ball FBGA (FGG256) —
Estilo de montagem SMD/SMT —
Packaging Tray Tray
Series M7AFS600 —
Live at Power-Up (LAPU) Yes —
Status RoHS [DATA_NEEDED: RoHS status] —
Analog Subsystem Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) Integrated configurable analog (per Microchip Fusion family page)
User I/O — 119
Encapsulamento — 256-LBGA (FBGA), 1 mm ball pitch
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Clock Management — Integrated clock generation and management circuitry (PLLs)
Temperature Grade — Industrial (I suffix)
Faixa de temperatura de operação — -40C to +85C (industrial grade standard range)
Tipo de montagem — Surface Mount
Nível MSL — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

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