M7AFS600-2FGG256I vs M7AFS600-FGG256I Comparação
Comparação detalhada lado a lado de M7AFS600-2FGG256I por Microchip Technology e M7AFS600-FGG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ AtivoMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ AtivoComparação de especificações
| Parâmetro | M7AFS600-2FGG256I | M7AFS600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $389,60 | $0,00 |
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) | Fusion Mixed-Signal FPGA |
| System Gates | 600000 | 600K |
| User I/O | 119 | 119 |
| Flash Memory Blocks | 110592 bits | — |
| Processor Support | ARM CoreMP7 | — |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS | 130 nm |
| System Performance | 350 MHz | — |
| Tensão de alimentação | 1.5 V (core) | — |
| Logic Family | CMOS | — |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) | — |
| Encapsulamento | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-LBGA (FBGA), 1 mm ball pitch |
| Number of Pins/Balls | 256 | — |
| Temperatura de operação | 0 to 70 C | — |
| Speed Grade | -2 | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| Faixa de temperatura de operação | — | -40C to +85C (industrial grade standard range) |
| Nível MSL | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |