MC13821FCR2 vs MC13820FCR2 Comparação

Comparação detalhada lado a lado de MC13821FCR2 por NXP Semiconductors e MC13820FCR2 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC13821FCR2 MC13821FCR2 - 2.4GHz ISM/GPS LNA with Bypass | NXP

MC13821FCR2 - 2.4GHz ISM/GPS LNA with Bypass | NXP

MC13821FCR2 Obsolete
NXP Semiconductors
MC13820FCR2 MC13820FCR2 - 800MHz-2.5GHz 18dB RF Amplifier IC | NXP

MC13820FCR2 - 800MHz-2.5GHz 18dB RF Amplifier IC | NXP

MC13820FCR2 Nrnd

Comparação de especificações

Parâmetro MC13821FCR2 MC13820FCR2
Marca NXP Semiconductors NXP Semiconductors
Categoria RF Amplifiers RF Amplifiers
Status do ciclo de vida Obsolete NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $2,30 $2,74
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Description Low Noise Amplifier with Bypass Switch —
RF Type ISM, GPS —
Frequency Range 1 GHz to 2.4 GHz 800 MHz to 2.5 GHz
Gain 16.5 dB (at 2.4 GHz) —
Noise Figure 1.45 dB (at 2.4 GHz) [DATA_NEEDED: noise figure]
Supply Voltage - Operating 2.75 V —
Operating Supply Current 2.8 mA —
Encapsulamento / Caixa 12-QFN (3x3 mm) with Exposed Pad —
Tipo de montagem Surface Mount Surface Mount
Bypass Switch Yes (logic-controlled) —
Temperatura de operação [DATA_NEEDED: operating temperature range] -40 C to +85 C
Input/Output Impedance External matching required (not internally matched to 50 ohms) 50 ohm (internally matched)
Status do ciclo de vida Obsolete (EOL) —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance per lot]
Nível MSL [DATA_NEEDED: MSL rating] —
Packing Tape & Reel (suffix R2) —
Função — RF Amplifier IC / General-Purpose Gain Block
Typical Gain — 18 dB (at 800 MHz)
Tensão de alimentação — 3 V (typical)
Corrente de alimentação — [DATA_NEEDED: quiescent supply current]
P1dB Output — [DATA_NEEDED: output 1 dB compression point]
Technology — BiCMOS SiGe
Encapsulamento — 12-QFN (3x3 mm) with exposed pad
Contagem de pinos — 12
Packaging — Tape & Reel (R2 suffix)
Target Applications — Cellular, ISM, PCS, GPS
Shutdown/Bias Mode — Yes (chip enable / power-down pin)

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