MC33887PEKR2 vs MC33887PEK Comparação
Comparação detalhada lado a lado de MC33887PEKR2 por NXP Semiconductors e MC33887PEK por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC33887PEKR2 | MC33887PEK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Motor Drivers | Motor Drivers |
| Status do ciclo de vida | Ativo | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $5,05 | $4,82 |
| Função | H-Bridge motor driver for brushed DC motors | — |
| Topologia | Monolithic H-Bridge with integrated MOSFETs and charge pump | — |
| Load Supply Voltage (VLOAD) | 5 V to 28 V | — |
| Logic Supply Voltage (VDD) | 3.0 V to 5.5 V | — |
| Continuous Output Current | 5.0 A | 5.0 A |
| Peak Output Current | 8.0 A | 8.0 A (pulse) |
| Rds(on) (per FET, typ @ 25C) | 150 mOhm [DATA_NEEDED: exact value from datasheet] | — |
| Current Sense Output | Yes, ratiometric analog feedback | — |
| Sleep Mode Current | < 50 uA (typ) [DATA_NEEDED: exact datasheet value] | < 50 uA typical |
| PWM Frequency Range | Up to 20 kHz [DATA_NEEDED: max PWM freq] | — |
| Faixa de temperatura de operação | -40C to +125C | — |
| Encapsulamento / Caixa | 54-SOICW-EP (Power SOIC with exposed pad) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Yes (automotive grade) | Qualified (automotive grade) |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | Lead-free; RoHS compliance per NXP product page |
| Configuração de saída | — | H-Bridge (full bridge) |
| Motor Type | — | Brushed DC |
| Supply Voltage (VPWR/VCC) | — | 5 V to 28 V |
| RDS(on) per MOSFET (typ) | — | 120 mOhm at 25 C |
| Current Feedback Ratio | — | 1/375 of high-side load current |
| Logic Input Compatibility | — | TTL / CMOS |
| PWM Frequency (recommended) | — | [DATA_NEEDED: PWM frequency max] |
| Temperatura de operação | — | -40 C to +125 C |
| Encapsulamento | — | 54-SOIC-EP (HSOP-54) with exposed thermal pad |
| Thermal Resistance (junction-to-case) | — | approximately 1 C/W |
| Protection Features | — | Thermal shutdown, cross-conduction prevention, internal current limit |
| Charge Pump | — | Internal (supports 100% duty cycle) |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |
| Tube Quantity | — | 27 per tube |