MC9S08AC128CFUE vs MC9S08AW48CFGER Comparação
Comparação detalhada lado a lado de MC9S08AC128CFUE por NXP Semiconductors e MC9S08AW48CFGER por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08AW48CFGER - 8-bit HCS08 MCU, 48KB Flash, 40MHz | NXP (Tape & Reel)
MC9S08AW48CFGER NrndComparação de especificações
| Parâmetro | MC9S08AC128CFUE | MC9S08AW48CFGER |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $7,41 | $4,05 |
| CPU Architecture | CISC S08 core | — |
| Architecture Family | MC9S08AC128 / Flexis AC family | — |
| Maximum CPU Frequency | 40 MHz | — |
| Largura do barramento de dados | 8 bit | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 128 KB | — |
| Internal RAM | 8 KB | — |
| ADC Resolution | 10 bit | — |
| ADC Channel Count | 16 channels | — |
| General-Purpose I/O | 54 pins | — |
| Typical Operating Supply Voltage | 3.3 V or 5 V | — |
| Operating Supply Range | 2.7 V to 5.5 V | — |
| Minimum Operating Temperature | -40 °C | — |
| Maximum Operating Temperature | 85 °C | — |
| Encapsulamento | 64-QFP, 14 mm x 14 mm | 44-pin LQFP (10x10 mm, 0.5 mm pitch) |
| Tipo de montagem | Surface mount | Surface Mount |
| Package Height | 2.4 mm maximum | — |
| Package Width | 14.1 mm maximum | — |
| Package Length | 14.1 mm maximum | — |
| Status RoHS | EU RoHS compliant | Compliant |
| Automotive Qualification | No | — |
| Core | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 48 KB (48K x 8) |
| RAM Size | — | 2 KB |
| I/O Ports | — | 38 (per NXP summary); 34 (per distributor listing) |
| Tensão de alimentação | — | 2.7 V to 5.5 V |
| Operating Temperature Grade | — | Industrial |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Single-wire background debug mode (BKGD) |
| ROM Type | — | Flash |