MC9S08AC32CFDE vs MC9S08AC16CFDE Comparação

Comparação detalhada lado a lado de MC9S08AC32CFDE por NXP Semiconductors e MC9S08AC16CFDE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08AC16CFDE MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP

MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP

MC9S08AC16CFDE ✗ Fim de vida

Comparação de especificações

Parâmetro MC9S08AC32CFDE MC9S08AC16CFDE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $3,02 $2,05
Core Architecture S08 (HCS08 family, 8-bit CISC) —
Program Memory (Flash) 32 KB —
RAM 1 KB —
Maximum CPU Frequency 40 MHz —
Supply Voltage (VDD) 2.7 V to 5.5 V —
Faixa de temperatura de operação -40 C to +125 C (automotive grade) —
Number of I/O Pins 38 —
Encapsulamento 48-QFN-EP (7x7 mm) with exposed thermal pad —
Tipo de montagem Surface Mount Surface Mount
ADC 8-channel, 10-bit —
Timers 16-bit timer/PWM, plus additional 8-bit and 2-channel modules —
Communication Interfaces SCI (UART) and SPI —
Debug Interface Single-wire BDM (Background Debug Mode) —
Internal Clock Source Yes (ICS - Internal Clock Source) —
Temperature Grade Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] —
Largura do barramento de dados 8-bit —
MSL (Moisture Sensitivity Level) MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] —
RoHS Compliance Compliant (per NXP product page) —
Lead-Free Yes (per distributor packaging datasheet) —
Status do ciclo de vida NRND (Not Recommended for New Designs, per NXP product page) —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-Bit
Frequência máxima de clock — 40 MHz
Flash Memory — 16 KB (16K x 8)
RAM Size — 4 KB
Supply Voltage Range — 2.7 V to 5.5 V
Number of I/O — 38
Program Memory Type — Flash
Package Type — 48-QFN-EP (7x7 mm), HVQCCN
Temperatura de operação — [DATA_NEEDED: operating temperature range]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Peripherals — [DATA_NEEDED: peripheral list (timers, SCI/SPI)]
Series — S08AC (Flexis series)
Life Cycle Stage — End of Life (per NXP product page)
Status RoHS — RoHS Compliant
Package Pin Count — 48
Packaging — Tray

Fichas técnicas e recursos

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