MC9S08DN60ACLH vs MC9S08DN60AMLH Comparação

Comparação detalhada lado a lado de MC9S08DN60ACLH por NXP Semiconductors e MC9S08DN60AMLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd
NXP Semiconductors
MC9S08DN60AMLH MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH - 8-Bit 40MHz 60KB MCU 64-LQFP | NXP

MC9S08DN60AMLH Nrnd

Comparação de especificações

Parâmetro MC9S08DN60ACLH MC9S08DN60AMLH
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $5,21 $8,58
Core HCS08 (S08 core) —
Largura do barramento de dados 8 bit —
CPU Frequency 40 MHz —
Bus Frequency 20 MHz —
Program Memory (Flash) 60 KB (60K x 8) —
RAM Size 2 KB (2K x 8) —
EEPROM Embedded (size [DATA_NEEDED: EEPROM size]) —
Number of I/O 53 —
Encapsulamento / Caixa 64-LQFP (10x10 mm) —
Tipo de montagem Surface Mount Surface mount
ADC 16-channel, 12-bit, 2.5 us conversion 10-bit
Communication Interfaces CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C —
Oscillator Type External —
Interrupt Sources Up to 32 —
Temperatura de operação -40C to +85C [DATA_NEEDED: confirm automotive grade range] [DATA_NEEDED: operating temperature range]
Packaging Tray —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Instruction Set HC08 + BGND instruction HCS08 instruction set
On-Chip Debug BDM (Background Debug Mode) —
Product Type — 8-bit microcontroller
CPU Core — Enhanced HCS08 core
Maximum CPU Frequency — 40 MHz
System Bus Frequency — 20 MHz
Flash Memory — 60 KB
Flash Organization — 60K x 8 bits
RAM — 2 KB
Serial Interface — Multiple serial interfaces
LIN Capability — LIN master
LCD Support — LCD driver
Encapsulamento — 64-LQFP, 10 x 10 mm
Embedded Emulation and Debug — Supported by HCS08 family documentation
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Fichas técnicas e recursos

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