MC9S08DZ60ACLF vs MC9S08DZ96MLH Comparação
Comparação detalhada lado a lado de MC9S08DZ60ACLF por NXP Semiconductors e MC9S08DZ96MLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndNXP Semiconductors
MC9S08DZ96MLH - 8-bit S08 MCU, 96KB Flash, 40MHz, 64-LQFP | NXP
MC9S08DZ96MLH NrndComparação de especificações
| Parâmetro | MC9S08DZ60ACLF | MC9S08DZ96MLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $6,85 | $8,32 |
| Core | HCS08 (8-bit CISC) | HCS08 (enhanced S08), 8-bit CISC |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | 2 KB (typical) |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | [DATA_NEEDED: exact EEPROM size on die] |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 24-channel, 12-bit, 2.5 µs conversion time |
| CAN | 1 x CAN 2.0 A/B | 1x MSCAN (CAN 2.0A/B), up to 32 message buffers |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | Yes (segmented LCD, up to 8x36 / 4x40) |
| Encapsulamento | 48-LQFP (7x7 mm) | 64-LQFP, 10 mm x 10 mm, 0.5 mm pitch |
| Temperatura de operação | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | — |
| Tipo de montagem | Surface Mount | Surface Mount (SMD) |
| Nível MSL | MSL 3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant | Compliant |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Flash Memory | — | 96 KB (96K x 8) |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| I/O Pins | — | 40 general-purpose I/O |
| Serial Interfaces | — | SCI1, SCI2 (UART), SPI1, SPI2, I2C |
| Timers / PWM | — | MTIM, TPM1, TPM2 (6-channel PWM) |
| Real-Time Counter (RTC) | — | Yes |
| Faixa de temperatura de operação | — | -40 °C to +85 °C (industrial) |