MC9S08GT60CFD vs MC9S08AC60CFGE Comparação

Comparação detalhada lado a lado de MC9S08GT60CFD por NXP Semiconductors e MC9S08AC60CFGE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08GT60CFD MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD ✓ Ativo
NXP Semiconductors
MC9S08AC60CFGE MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE Nrnd

Comparação de especificações

Parâmetro MC9S08GT60CFD MC9S08AC60CFGE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $5,10 $3,42
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Family HCS08 S08GT Series —
Core Architecture HCS08 (8-bit CISC) —
Program Memory Size 60 KB (60K x 8) Flash —
RAM Size 4 KB (4K x 8) —
Maximum CPU Frequency 40 MHz 40 MHz
Number of I/O Pins 39 —
Encapsulamento / Caixa 48-VFQFN Exposed Pad (48-QFN 7x7 mm) —
Tensão de alimentação de operação 2.5V / 3.3V —
Number of Interrupts/Reset Sources Up to 32 —
Tipo de montagem Surface Mount Surface Mount
Tray Packaging Tray (per FindIC listing) —
Background Debug Mode Yes (BGND instruction) —
Internal Pullup Yes (RESET and IRQ pins) —
Status RoHS [DATA_NEEDED: RoHS compliance status] RoHS compliant
Core Processor — S08 (HCS08), 8-bit CISC
Core Size — 8-bit
Internal Bus Frequency — 20 MHz
Flash Memory — 60 KB (60K x 8)
RAM — 2 KB
Supply Voltage Range — 2.7 V to 5.5 V
Operating Supply — 3.3 V / 5 V
ADC Resolution — 10-bit
ADC Channels (44-pin package) — 8-channel (up to 16-channel family max)
Communication Interfaces — 2x SCI (LIN 2.0, SAE J2602), SPI, IIC
GPIO (44-pin package) — 34 general-purpose I/O
I/O Ports (family max) — 38
Encapsulamento — 44-LQFP (10 x 10 mm)
Packaging — Tray
Temperatura de operação — [DATA_NEEDED: operating temperature range]
Debug Interface — Background Debug Mode (BDM), 6-pin connector
Series — S08AC (Flexis AC family)

Fichas técnicas e recursos

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