MC9S08SH4MFK vs MC9S08SH4CFK Comparação
Comparação detalhada lado a lado de MC9S08SH4MFK por NXP Semiconductors e MC9S08SH4CFK por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08SH4MFK | MC9S08SH4CFK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $2,15 | $0,00 |
| Core | HCS08 (8-bit) | — |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 256 B | — |
| Maximum CPU Clock | 40 MHz | — |
| Number of I/O Pins | 17 | — |
| Encapsulamento / Caixa | 24-VFQFN Exposed Pad (4x4 mm) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 us conversion | — |
| Oscillator Type | Internal | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with BGND instruction | — |
| Packaging | Tray | — |
| Tipo de montagem | Surface Mount | No-lead surface mount |
| Temperatura de operação | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) | — |
| Compliance | RoHS compliant ([DATA_NEEDED: confirm exact status]) | — |
| Product Type | — | 8-bit S08SH microcontroller |
| Processor Core | — | HCS08 CPU |
| Frequência máxima de clock | — | 40 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Largura do barramento de dados | — | 8 bit |
| RAM Memory | — | 256 B |
| ADC Resolution | — | 10 bit |
| ADC Channel Count | — | 12 channels |
| Interrupt and Reset Sources | — | Up to 32 sources |
| Integrated Peripherals | — | Timers and ADC |
| Operating Application Range | — | Low-end 5 V embedded applications |
| Encapsulamento | — | 24-QFN-EP, 4 mm x 4 mm |
| Package Code | — | HVQCCN |
| Terminal Count | — | 24 terminals |
| Temperature Grade | — | Industrial |
| Process Technology | — | 0.25 µm |
| Power Consumption | — | Low-power operation |
| Status do ciclo de vida | — | End of Life |