MC9S12DG128CPVE vs MC9S12DJ128MPVE Comparação

Comparação detalhada lado a lado de MC9S12DG128CPVE por NXP Semiconductors e MC9S12DJ128MPVE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DG128CPVE MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE Nrnd
NXP Semiconductors
MC9S12DJ128MPVE MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE - 16-bit HCS12 MCU, 128KB Flash | NXP

MC9S12DJ128MPVE Nrnd

Comparação de especificações

Parâmetro MC9S12DG128CPVE MC9S12DJ128MPVE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $19,25
Product Type 16-bit HCS12 microcontroller —
Core Frequency 25 MHz —
Program Memory 128 KB flash —
RAM 8 KB 8 KB
EEPROM 2 KB 2 KB
Architecture HCS12, CISC —
Tensão de alimentação 2.35 V to 5.25 V 2.35 V to 2.75 V (single 2.5V nominal)
ADC Two 8-channel, 10-bit ADCs; 16 channels total 2x 8-channel, 10-bit
Serial Communications Two asynchronous serial communications interfaces —
Timer 8-channel IC/OC enhanced capture timer —
PWM 8-channel pulse-width modulator —
Digital I/O 20 discrete digital I/O lines —
Temperatura de operação -40°C to +85°C -40C to +125C (automotive grade)
Encapsulamento 112-LQFP, 20 mm x 20 mm 112-LQFP (20x20 mm)
Oscillator Internal oscillator —
Automotive Qualification AEC-Q100 listed in verified distributor result —
RoHS [DATA_NEEDED: RoHS status] —
REACH [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Core Architecture — HCS12 (16-bit CISC)
Program Memory (Flash) — 128 KB (128K x 8)
Maximum CPU Clock — 25 MHz (50 MHz internal bus via PLL, see datasheet)
Digital I/O Pins — 59
PWM Channels — 8
SCI (UART) — 2
SPI — 1
I2C (Inter-IC Bus) — 1
Tipo de montagem — Surface Mount
Nível MSL — [DATA_NEEDED: MSL level per JEDEC J-STD-020]
Debug Interface — BDM (Background Debug Mode)
Status RoHS — Compliant

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