MC9S12DG128MFUE vs MC9S12DJ64MFUE Comparação

Comparação detalhada lado a lado de MC9S12DG128MFUE por NXP Semiconductors e MC9S12DJ64MFUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DG128MFUE MC9S12DG128MFUE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP

MC9S12DG128MFUE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP

MC9S12DG128MFUE Nrnd
NXP Semiconductors
MC9S12DJ64MFUE MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE - HCS12 16-bit MCU 64KB Flash 80-QFP | NXP

MC9S12DJ64MFUE Nrnd

Comparação de especificações

Parâmetro MC9S12DG128MFUE MC9S12DJ64MFUE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $10,50 $8,20
Core HCS12 (CISC, 16-bit) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 128 KB (128K x 8) —
RAM 8 KB —
EEPROM 2 KB —
Largura do barramento de dados 16 bit —
Tensão de alimentação 2.35 V to 2.75 V (core); single 5 V supply with on-chip regulator —
I/O Pins 59 (discrete digital I/O lines) —
ADC 2 x 8-channel, 10-bit 8-channel, 10-bit
PWM Channels 8 8 (4x 16-bit or 8x 8-bit via ECT)
SCI (UART) 2 —
SPI 1 —
IIC (I2C) 1 —
Timers Enhanced Capture Timer (8-channel IC/OC), PIT, RTI ECT (Enhanced Capture Timer), 16-bit, 8-channels
Faixa de temperatura de operação -40C to +125C (automotive grade, MC suffix) —
Encapsulamento LQFP-80 (14x14 mm), FUE suffix —
Tipo de montagem Surface Mount Surface Mount
Debug Interface Background Debug Mode (BDM) Background Debug Mode (BDM), single-wire
On-chip Voltage Regulator Yes (single 5 V supply) —
Status RoHS Compliant Compliant
Core Architecture — HCS12 (CISC, 16-bit)
CPU Frequency — 25 MHz
Program Memory — 64 KB Flash (64K x 8)
RAM Size — 4 KB
EEPROM Size — 1 KB
Data Flash (Emulation) — 8 KB shared Flash region [DATA_NEEDED: confirmed address range]
CAN Modules — 2x msCAN 2.0 A/B
SCI / SPI — 2x SCI, 1x SPI
GPIO Count — [DATA_NEEDED: exact GPIO count per package]
Operating Voltage — 5 V (typical, 2.5 V for MCU core via internal regulator) [DATA_NEEDED: full min/max range]
Temperatura de operação — -40C to +125C
Package Type — 80-QFP (14x14 mm)

Fichas técnicas e recursos

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