MCF5275CVM166 vs MCF5274LCVM166 Comparação
Comparação detalhada lado a lado de MCF5275CVM166 por NXP Semiconductors e MCF5274LCVM166 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 NrndNXP Semiconductors
MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP
MCF5274LCVM166 NrndComparação de especificações
| Parâmetro | MCF5275CVM166 | MCF5274LCVM166 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $24,20 | $16,20 |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (MCF527x family) |
| Frequência máxima de clock | 166 MHz | — |
| On-Chip SRAM | 64 KB | — |
| Program Memory Size | ROMless | — |
| Program Memory Type | External (ROMless) | — |
| Encapsulamento | 256-MAPBGA (17x17 mm) | 196-LBGA (15x15 mm) |
| Number of I/O Lines | 69 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB | — |
| Ethernet | Dual 10/100 MAC | 10/100 Fast Ethernet MAC (integrated PHY on selected family members) |
| USB | USB 1.1 device/host | USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members) |
| CAN | 2x CAN 2.0B | — |
| Peripherals | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) | — |
| Supply Voltage Core | 1.5 V | — |
| Supply Voltage I/O | 3.3 V | — |
| Temperatura de operação | -40C to +85C (industrial) | [DATA_NEEDED: exact operating temperature range] |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (per distributor listing) |
| Core Architecture | — | 32-bit RISC (ColdFire) |
| Maximum Core Frequency | — | 166 MHz |
| Core Supply Voltage | — | 1.5 V |
| I/O Supply Voltage | — | 3.3 V |
| Program Memory | — | ROMless (external boot) |
| RAM | — | [DATA_NEEDED: internal SRAM size] |
| Temperature Grade | — | Industrial |
| Cryptography | — | Hardware crypto accelerator (DES / 3DES / AES / SHA-1) |
| External Memory Bus | — | SDRAM / SRAM / ROM controller |
| DMA Channels | — | [DATA_NEEDED: number of DMA channels] |
| Serial Peripherals | — | UART, I2C, QSPI |