MPC7410VS500LE vs MC7447AVS1000LB Comparação

Comparação detalhada lado a lado de MPC7410VS500LE por NXP Semiconductors e MC7447AVS1000LB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC7410VS500LE MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP

MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP

MPC7410VS500LE ⚠ Última compra
NXP Semiconductors
MC7447AVS1000LB MC7447AVS1000LB - 1GHz PowerPC G4 MPU, 360-FCCLGA | NXP

MC7447AVS1000LB - 1GHz PowerPC G4 MPU, 360-FCCLGA | NXP

MC7447AVS1000LB Obsolete

Comparação de especificações

Parâmetro MPC7410VS500LE MC7447AVS1000LB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Última compra Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $162,00 $121,00
Manufacturer NXP USA Inc. (formerly Freescale, originally Motorola) —
Product Type 32-bit Embedded Microprocessor (MPU) —
Series MPC74xx (NITRO) —
Core PowerPC G4, 1 Core —
Architecture Power Architecture with AltiVec SIMD —
Largura do barramento de dados 32-bit 32-bit
Frequência máxima de clock 500 MHz 1.0 GHz
Silicon Revision R1.4 —
Temperatura de operação 0 °C to 105 °C (NITRO industrial) —
Process Technology 0.13 µm CMOS 130 nm CMOS with copper interconnect
Core / I/O Voltage 1.8 V core / 2.5 V I/O (typical) —
L1 Cache 32 KB instruction + 32 KB data —
SIMD Engine AltiVec 128-bit vector unit —
FPU Hardware double-precision floating-point —
MMU Yes (BookE-enhanced PowerPC) —
System Bus MPX high-bandwidth bus —
Encapsulamento 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA 360-FCCLGA (25 x 25 mm)
Lead-Free (Pb-Free) Yes (LE suffix) —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Tipo de montagem Surface Mount —
Core Architecture — PowerPC G4 (MPC74xx) with AltiVec/VMX SIMD
Number of Cores — 1
L1 Instruction Cache — 64 KB
L1 Data Cache — 32 KB
L2 Cache (on-chip) — 512 KB unified
System Bus / MPX Bus — 200 MHz, up to 3.2 GB/s
Supply Voltage (Core) — 1.8 V
Supply Voltage (I/O) — 2.5 V
Faixa de temperatura de operação — [DATA_NEEDED: operating temperature range]
Junction Temperature (Tj max) — 105 °C
Typical Power Dissipation — approximately 20 W at 1.0 GHz (Estimated: based on typical MPC74xx @ 1 GHz core voltage)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free / halogen-free]

Fichas técnicas e recursos

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