MPC8255ACVVMHBB vs MPC8245LZU266D Comparação
Comparação detalhada lado a lado de MPC8255ACVVMHBB por NXP Semiconductors e MPC8245LZU266D por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Ativo
Comparação de especificações
| Parâmetro | MPC8255ACVVMHBB | MPC8245LZU266D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | — |
| Number of Cores | 1 | — |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Encapsulamento | 480-TBGA (37.5 x 37.5 mm) | 352-TBGA (35 mm x 35 mm) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | [DATA_NEEDED: confirm per lot] |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | MPC82xx |
| Part Status | — | Active |
| Core Processor | — | PowerPC 603e |
| Number of Cores / Bus Width | — | 1 Core / 32-bit |
| Speed (Clock Frequency) | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Co-Processor / DSP | — | None |
| RAM Controllers | — | SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED: display controller details] |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet?] |
| PCI Interface | — | 32-bit, 33/66 MHz |
| Memory Controller Max Frequency | — | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | — | I2C, UART, I2O |
| Tensão de alimentação | — | 3.3 V (typ.) |
| Process Technology | — | 0.25 um CMOS |
| Temperatura de operação | — | 0 C to +105 C (commercial) |
| Tipo de montagem | — | Surface Mount |
| Tray Quantity | — | [DATA_NEEDED: tray qty per manufacturer packing] |
| Lead-Free Status | — | Lead-free (BGA balls, SnAgCu) |