MPC8536ECVTATHA vs MPC8536EBVTATHA Comparação

Comparação detalhada lado a lado de MPC8536ECVTATHA por NXP Semiconductors e MPC8536EBVTATHA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8536ECVTATHA MPC8536ECVTATHA - 1.25GHz PowerQUICC III MPU, 783-FCPBGA | NXP

MPC8536ECVTATHA - 1.25GHz PowerQUICC III MPU, 783-FCPBGA | NXP

MPC8536ECVTATHA ✓ Ativo
NXP Semiconductors
MPC8536EBVTATHA MPC8536EBVTATHA - PowerQUICC III 1.25GHz MPU, 783-FCBGA | NXP

MPC8536EBVTATHA - PowerQUICC III 1.25GHz MPU, 783-FCBGA | NXP

MPC8536EBVTATHA ✓ Ativo

Comparação de especificações

Parâmetro MPC8536ECVTATHA MPC8536EBVTATHA
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $138,00 $99,40
Core Architecture Power Architecture e500 Power Architecture e500
Largura do barramento de dados 32-Bit 32-bit
Maximum Core Frequency 1.5 GHz (e500 scales to 1.5 GHz; this variant operates up to 1.25 GHz) 1.25 GHz
Operating Frequency (this variant) 1.25 GHz —
Tensão de alimentação 1.1 V —
Instruction Set Power Architecture, 36-bit physical addressing —
Number of Cores 1 —
L1 Cache [DATA_NEEDED: L1 instruction/data cache size] —
L2 Cache [DATA_NEEDED: L2 cache size] 256 KB (integrated)
Memory Controller DDR2/DDR3 DDR2 / DDR3 SDRAM with ECC, up to 16 GB
Ethernet Gigabit Ethernet (GbE) —
Storage Interfaces SATA, SDHC —
Expansion Interfaces PCI, PCI Express (PCIe) —
Security Accelerator SEC engine —
Package Type FCPBGA-783, 29 x 29 mm, 1 mm pitch, 2.80 mm height —
Contagem de pinos 783 —
Tipo de montagem Surface Mount (BGA) Surface Mount
Lead-Free Yes (lead-free FCBGA) —
Temperatura de operação -40C to +105C (industrial) 0 °C to +105 °C (Tj)
Status RoHS [DATA_NEEDED: explicit RoHS compliance value from verified data] [DATA_NEEDED: RoHS status]
Core Count — 1
Encapsulamento — 783-FCBGA (FC-PBGA, 29x29 mm)
Process Technology — 90 nm CMOS
Operating Voltage (Core) — 1.0 V (typ)
Operating Voltage (I/O) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
Gigabit Ethernet — 4x SGMII / RGMII
PCI Express — 3 controllers (endpoint / root complex)
SATA — 2 controllers
USB — 2x USB 2.0 (host + device)
Security Engine (SEC) — AES, DES/3DES, SHA-1/2, RSA, RNG
Local Bus — Enhanced local bus controller (eLBC)
Nível MSL — [DATA_NEEDED: MSL rating]

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