RTAX4000SL-1CQ352EV vs RTAX4000SL-CQ352EV Comparação
Comparação detalhada lado a lado de RTAX4000SL-1CQ352EV por Microchip Technology e RTAX4000SL-CQ352EV por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
RTAX4000SL-1CQ352EV - 4M Gate Rad-Tolerant FPGA 352-Pin CQFP | Microchip
RTAX4000SL-1CQ352EV ✓ AtivoMicrochip Technology
RTAX4000SL-CQ352EV - 4M Gate Rad-Tolerant FPGA | Microchip
RTAX4000SL-CQ352EV ✓ AtivoComparação de especificações
| Parâmetro | RTAX4000SL-1CQ352EV | RTAX4000SL-CQ352EV |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $10.250,00 |
| Family | RTAX-SL (Radiation-Tolerant FPGA) | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 4000000 | — |
| Logic Cells | 40320 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS antifuse |
| Speed Grade | 1 | — |
| Encapsulamento | 352-pin Ceramic CQFP (CQ352) | 352-pin CQFP (Ceramic Quad Flat Pack) |
| JESD-30 Package Code | S-CQFP-F352 | — |
| Configuration Technology | Antifuse (live at power-up, single chip) | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | — |
| Clock Resources | Segmentable clock conditioning circuits | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Application Domain | Space-flight systems (radiation tolerant) | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| I/O Count | [DATA_NEEDED: usable I/O count for CQ352] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| System Gates | — | 4,000,000 |
| Logic Cells (ASIC Gates) | — | 40,320 |
| Screening Level | — | EV (enhanced spaceflight screening) |
| Programming Technology | — | Antifuse (one-time programmable, live at power-up) |
| Radiation Tolerance | — | Radiation-tolerant (TID/SEL/SEU per family datasheet) |
| Configuration | — | Single-chip, no external boot memory |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O bank voltage] |
| Maximum System Frequency | — | [DATA_NEEDED: maximum system frequency] |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Package Material | — | Hermetic ceramic (JESD-30 S-CQFP-F352) |
| Typical Application | — | Space-flight systems, satellites, payload processing |