S9S08DZ60F1MLF vs MC9S08DZ60ACLF Comparação

Comparação detalhada lado a lado de S9S08DZ60F1MLF por NXP Semiconductors e MC9S08DZ60ACLF por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
S9S08DZ60F1MLF S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP

S9S08DZ60F1MLF ✓ Ativo

Comparação de especificações

Parâmetro S9S08DZ60F1MLF MC9S08DZ60ACLF
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $4,95 $6,85
Manufacturer NXP USA Inc. (formerly Freescale Semiconductor) —
Product Type 8-Bit Microcontroller (MCU) —
Core Architecture HCS08 (enhanced HCS08 core) —
CPU Speed 40 MHz (20 MHz bus) —
Program Memory Size 60 KB (60K x 8) FLASH —
RAM Size 4 KB (4K x 8) —
Number of I/O Lines 39 —
Encapsulamento / Caixa 48-LQFP (7x7 mm) —
Tensão de alimentação 3.3 V / 5 V —
Tipo de montagem Surface Mount Surface Mount
Terminal Form GULL WING —
Temperature Grade Automotive (per part suffix 'F' / 'LF') —
Temperatura de operação [DATA_NEEDED: full operating temperature range] -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range]
Instruction Set HC08 with BGND instruction HC08 instruction set with added BGND instruction
Oscillator Type External (per package options) —
Peripherals MSCAN (CAN 2.0), SCI, SPI, ADC, Timers —
Status RoHS [DATA_NEEDED: confirm RoHS lead-free finish] Compliant
Nível MSL [DATA_NEEDED: MSL rating per JEDEC J-STD-020] MSL 3 (per JEDEC J-STD-020)
Core — HCS08 (8-bit CISC)
Core Frequency — 40 MHz (20 MHz bus)
Program Memory (Flash) — 60 KB (60K x 8)
RAM — 4 KB
EEPROM / Emulated EEPROM — Available (size [DATA_NEEDED: EEPROM size])
Operating Voltage — 2.7 V to 5.5 V
Supply Rails — 3.3 V / 5 V
ADC — 24-channel, 12-bit, 2.5 us conversion
CAN — 1 x CAN 2.0 A/B
LIN — Master LIN 2.0 interface
Communication Peripherals — SCI (SPI), IIC, MSCAN
Timer / PWM Channels — Multiple (count [DATA_NEEDED: timer/PWM channel count])
LCD Driver — Yes (on-chip segment LCD driver)
Encapsulamento — 48-LQFP (7x7 mm)
Background Debug Mode (BGND) — Yes (on-chip emulation/debug)

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