XC6SLX45-3FGG484C vs XC6SLX45-2FG484I Comparação

Comparação detalhada lado a lado de XC6SLX45-3FGG484C por AMD e XC6SLX45-2FG484I por Xilinx. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro XC6SLX45-3FGG484C XC6SLX45-2FG484I
Marca AMD Xilinx
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Unknown
Series Spartan-6 LX —
Logic Cells 43,661 43,661 cells
System Gates 2,138,112 —
CLBs 3,411 —
User I/Os 316 —
Block RAM 2,011 Kbits (2,088 Kb) —
DSP48A1 Slices 58 —
Speed Grade -3 -2
Operating Frequency 862 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Encapsulamento 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch 484-BBGA
Temperatura de operação 0 C to +85 C (commercial, "C" suffix) —
Supply Voltage VCCINT 1.0 V to 1.05 V —
Supply Voltage VCCO 1.2 V to 3.3 V —
Memory Controller Blocks 2 (DDR/DDR2/DDR3/LPDDR) —
Tipo de montagem Surface Mount Surface mount
Lead Free / RoHS Yes (LEAD FREE per distributor descriptions) —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
Number of I/O — 316 I/O
Listed Internal Frequency — 500 MHz
Core Operating Voltage — 1.2 V
Device Family — Spartan-6 LX
Temperature Grade — Industrial
Faixa de temperatura de operação — -40°C to +100°C (junction temperature)
Package Pitch — 0.80 mm
Package Lead-Free Status — Lead free
Number of Logic Cells in Alternative Comparison — 43,661 cells
Adaptive Logic Modules — [DATA_NEEDED: Adaptive Logic Module count]
Embedded Memory — [DATA_NEEDED: Embedded block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
Configuration Memory — [DATA_NEEDED: Configuration memory type and capacity]
Status RoHS — [DATA_NEEDED: RoHS compliance status]
REACH Status — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Status — [DATA_NEEDED: AEC-Q100 qualification status]

Fichas técnicas e recursos

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