XC6SLX9-2FT256C vs XC6SLX9-2FT256I Comparação
Comparação detalhada lado a lado de XC6SLX9-2FT256C por AMD e XC6SLX9-2FT256I por AMD. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | XC6SLX9-2FT256C | XC6SLX9-2FT256I |
|---|---|---|
| Marca | AMD | AMD |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Unknown | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $23,10 |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 9,152 cells | — |
| I/O Count | 186 I/O | — |
| Internal Frequency | 667 MHz | — |
| Speed Grade | -2 | -2 |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package Type | FTBGA-256 | — |
| Package Dimensions | 17 mm × 17 mm | — |
| Package Pitch | 1 mm | — |
| Package Outline | MS-034 | — |
| Ball Count | 256 balls | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Faixa de temperatura de operação | 0°C to 85°C | — |
| Temperature Grade | Commercial | — |
| Configuration | Programmable FPGA | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 |
| Block RAM (bits) | — | 589,824 (576 Kb) |
| Number of User I/Os | — | 186 |
| DSP48A1 Slices | — | 16 |
| Logic Slices | — | 1,430 |
| Number of CLBs | — | 1,430 |
| Process Technology | — | 45 nm CMOS |
| Auxiliary Supply Voltage | — | 3.3 V |
| I/O Supply Voltage | — | 1.2 V to 3.3 V |
| Maximum Internal Frequency | — | 667 MHz |
| Number of PLLs | — | 2 (CMTs) |
| Encapsulamento | — | 256-FTBGA (FT256), 17 x 17 mm, 1.0 mm pitch |
| Temperatura de operação | — | -40C to +100C (Industrial, I suffix) |
| Configuration Modes | — | JTAG, SPI, BPI, MultiBoot, SelectMAP |
| Configuration Bitstream Size | — | 2.7 Mb typical |
| MSL Moisture Sensitivity | — | Level 3 (per JEDEC J-STD-020) |
| RoHS Compliance | — | Compliant |
| Lead-Free / Pb-Free | — | Yes |
| Livre de halogênio | — | Yes |