10AS032E3F29I2LG - Arria 10 SX SoC FPGA 320K LE 20nm | Intel
N.º da peça: 10AS032E3F29I2LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1485 | $742.500,00 |
| 1.000 | $1390 | $1.390.000,00 |
10AS032E3F29I2LG Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic after manufacturing. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and specialized hardened IP such as transceivers, memory controllers, and DSP slices. SoC FPGAs extend this concept by integrating a hard processor core, eliminating the need for an external CPU and reducing board space, BOM cost, and power in embedded designs. The Arria 10 SX family specifically targets mid-range applications that require both ARM-class processing and substantial FPGA logic density.
Key features of the 10AS032E3F29I2LG include up to 17.4 Gbps multi-rate transceivers supporting protocols such as PCIe Gen3, 10GbE, and JESD204B; hardware floating-point DSP blocks; variable-precision DSP support; up to 1.5 GHz ARM Cortex-A9 MPCore with CoreSight debug; and integrated memory controllers supporting DDR4, DDR3, and QDRIV SRAM. The device also supports partial reconfiguration, allowing portions of the FPGA fabric to be reprogrammed while other portions continue operating.
Typical applications include high-performance signal processing in wireless base stations, software-defined radio, video broadcast equipment, industrial imaging, and defense radar systems. The SoC integration makes it well suited for applications requiring tight coupling between software running on the ARM cores and high-bandwidth hardware accelerators in the FPGA fabric.
When designing with this part, ensure your PCB supports the 1.0 mm pitch FCBGA-780 land pattern and provides adequate power decoupling across the 0.9V core and 1.5GHz SoC rails. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. Engineers migrating from Stratix or Cyclone families should review the Arria 10 transceiver and memory interface IP cores.
This page synthesizes distributor pricing, drop-in package alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet, providing a faster path to design decisions than reading the full Arria 10 device handbook.
Alternativas drop-in para 10AS032E3F29I2LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AS032E3F29I2LG (mesmo formato e footprint) — diferindo em Package, Operating Temperature Grade, Mounting Type, Logic Elements, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AS032E3F29I2SG
✅ Drop-In✓ Em estoque
$1295 / unidade
Ver ficha técnica →10AS032E3F29I3LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AS032E2F29I2LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AS032E1F29I2LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AS032E4F29I2LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AS066E3F29I2LG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10AS032E3F29I2LG Classificações máximas e características elétricas
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements (LE) | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor Core Frequency | 1.5 GHz |
| Encapsulamento | 780-pin FCBGA (29x29 mm) |
| Package Code | F29 (FBGA, FC) |
| Transceiver Data Rate | Up to 17.4 Gbps |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| DSP Blocks | Yes (variable-precision, floating-point) |
| Memory Interfaces | DDR4, DDR3, QDRIV SRAM |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10AS032E3F29I2LG f29 (fbga, fc)
Configuração de pinos para 10AS032E3F29I2LG (pacote f29 (fbga, fc)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AS032E3F29I2LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AS032E3F29I2LG é adequado para 7 aplicaçãos: Wireless Base Station Signal Processing, Software-Defined Radio (SDR) Platforms, Video Broadcast and Imaging Systems, Industrial Imaging and Machine Vision, Defense Radar and Electronic Warfare, Medical Imaging Systems, Aerospace Flight Control and Avionics.
Wireless Base Station Signal Processing
The 10AS032E3F29I2LG is well suited for wireless base station baseband processing, where its 320K logic elements and 17.4 Gbps transceivers handle CPRI and JESD204B data links. The variable-precision DSP blocks enable efficient implementation of LTE and 5G NR channel filters, crest-factor reduction algorithms, and digital predistortion (DPD) loops. The dual ARM Cortex-A9 cores run the PHY stack and MAC layer in real time, eliminating the need for an external CPU. Operating at 0.9V core voltage, it balances performance and power for outdoor radio units in industrial temperature conditions.
Recomendado
Software-Defined Radio (SDR) Platforms
The 10AS032E3F29I2LG supports wideband SDR applications where FPGA fabric handles real-time DSP for modulation, demodulation, and channelization. With 17.4 Gbps transceivers, the device interfaces directly to RF ADCs and DACs such as the AD9371 family, supporting multi-band simultaneous operation. The integrated ARM Cortex-A9 cores execute Linux distributions for control-plane processing, while the FPGA handles data-plane DSP at gigasample-per-second rates. The 780-pin FCBGA package supports the high-pin-count requirements of multi-channel RF interfaces in industrial temperature environments.
Recomendado
Video Broadcast and Imaging Systems
The 10AS032E3F29I2LG is deployed in professional video broadcast equipment for 4K/UHD video processing, format conversion, and on-air graphics overlays. Its 320K logic elements implement video scalers, color-space converters, and HDR processing pipelines in real time. The integrated ARM cores run control software and user interfaces for broadcast workflow management. With PCIe Gen3 support, the device interfaces to host servers for content streaming and storage. The industrial temperature rating ensures reliable operation in broadcast studio and outdoor transmitter environments.
Recomendado
Industrial Imaging and Machine Vision
The 10AS032E3F29I2LG powers industrial machine vision systems where the FPGA fabric accelerates image preprocessing, defect detection, and pattern recognition algorithms. CoaXPress and Camera Link interfaces are supported via the 17.4 Gbps transceivers, enabling multi-gigapixel-per-second image acquisition. The ARM Cortex-A9 cores run Linux for factory network connectivity and PLC integration. The 0.9V core voltage keeps power dissipation manageable in sealed industrial enclosures with industrial temperature operation from -40C to +100C.
Recomendado
Defense Radar and Electronic Warfare
The 10AS032E3F29I2LG is used in defense radar preprocessing and electronic countermeasure systems, where the FPGA performs pulse compression, MTI filtering, and beamforming on wideband radar returns. Its 17.4 Gbps transceivers interface to high-speed RF converters and digital receivers, while the dual ARM cores run classification and tracking algorithms. Variable-precision DSP blocks enable floating-point signal processing at hardware speeds. Industrial temperature operation and lead-free packaging meet MIL-PRF environmental screening requirements for defense platforms.
Recomendado
Medical Imaging Systems
The 10AS032E3F29I2LG accelerates reconstruction algorithms in CT, MRI, and ultrasound imaging systems where real-time image processing is critical. The FPGA fabric implements filtered back-projection and iterative reconstruction at frame rates required for clinical workflow. The integrated ARM cores handle patient data management, DICOM networking, and user interface control. With industrial temperature operation and RoHS-compliant lead-free packaging, the device meets medical equipment manufacturer requirements for reliability and environmental compliance in diagnostic imaging installations.
Recomendado
Aerospace Flight Control and Avionics
The 10AS032E3F29I2LG supports avionics systems requiring deterministic real-time processing for flight control, sensor fusion, and data telemetry. The FPGA implements multiple ARINC 429, MIL-STD-1553, and Ethernet interfaces in parallel, while the ARM Cortex-A9 cores run flight management software. With industrial temperature operation and lead-free RoHS status, the device supports commercial aerospace applications. Designers should pair the SoC FPGA with radiation-tolerant external memory and implement watchdog supervision for DO-178C compliance in certified avionics designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AS032E3F29I2LG — comparação, orientação de projeto e informações de conformidade.
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Comparação com alternativas
| Parâmetro | Este produto | 10AS032E3F29I2SG | 10AS032E3F29I3LG | 10AS032E2F29I2LG | 10AS032E1F29I2LG | 10AS032E4F29I2LG | 10AS066E3F29I2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FCBGA (F29, 29x29 mm) | 780-pin FCBGA (F29) - same | 780-pin FCBGA (F29) - same | 780-pin FCBGA (F29) - same | 780-pin FCBGA (F29) - same | 780-pin FCBGA (F29) - same | 780-pin FCBGA (F29) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 660,000 |
| Speed Grade | E3 | E3 | E3 | E2 | E1 | E4 | E3 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Extended Industrial (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Principais diferenciais
- Integrated ARM Cortex-A9 hard processor eliminates external CPU BOM (vs Arria 10 GX (10AX032E3F29I2LG))
- Industrial temperature grade in same F29 package (vs 10AS032E3F29I2SG)
- Mid-range 320K LE density optimizes cost-performance (vs 10AS066E3F29I2LG)
Notas de projeto
The 780-pin FCBGA package requires a 1.0 mm ball pitch PCB land pattern (verify exact pitch in datasheet) with microvia technology and 4-6 layer stackup with continuous ground planes. Use high-density interconnect (HDI) PCB processes with buried and blind vias to escape the dense ball grid. Maintain matched-length routing for transceivers and DDR4 memory interfaces, with impedance-controlled traces (100 ohm differential for transceivers, 50 ohm single-ended for general-purpose I/O). Place decoupling capacitors within 100 mils of each power pin, using 0402 or 0201 ceramic X7R capacitors.
Estimated: The 10AS032E3F29I2LG at full utilization (320K LE + 17.4 Gbps transceivers + dual ARM Cortex-A9 cores) can dissipate 15-25 W depending on toggle rate and configuration. Industrial temperature grade requires junction temperature to remain below 100C. Provide a thermal pad on the PCB and connect to the package exposed pad through thermal vias (0.3 mm drill, 1.2 mm pitch). For high-ambient-temperature applications, consider a heatsink or forced-air cooling to maintain junction temperature margin. Use the Arria 10 thermal model from Intel to perform thermal simulation for your specific enclosure.
Transceiver channels running at 17.4 Gbps require careful PCB stackup design with low-loss dielectric material (such as Megtron 6 or FR-4-Standard) and matched differential pair routing within 5 mil tolerance. Use IBIS-AMI models from Intel for channel simulation, and verify loss budget is within 15 dB at the Nyquist frequency. DDR4 interfaces require fly-by topology with VTT termination at the end of the address/command bus; consult Intel's external memory interface handbook for the Arria 10 EMIF IP. Place reference voltage decoupling within 200 mils of each reference pin.
Informações de conformidade
RoHS and lead-free confirmed by 'LG' suffix in OPN per Intel ordering information. Industrial temperature grade (I2) is not AEC-Q100 qualified; automotive applications should evaluate Cyclone V or other automotive-grade FPGAs. Halogen-free status not specified in retrieved data.
