10AX115S3F45I2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Altera (Intel)
N.º da peça: 10AX115S3F45I2LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $16500 | $16.500,00 |
| 10 | $15250 | $152.500,00 |
| 25 | $14600 | $365.000,00 |
| 50 | $13950 | $697.500,00 |
| 100 | $13200 | $1.320.000,00 |
10AX115S3F45I2LG Visão geral
Arria 10 GX devices belong to the mid-range, transceiver-rich FPGA family in Intel's programmable-logic portfolio. Architecturally, an Arria 10 GX combines a hardened 28 Gbps-capable transceiver array, variable-precision DSP blocks, and on-chip memory into a single die, enabling designers to implement high-bandwidth signal processing, backplane aggregation, and protocol bridging in a single chip. The Arria 10 family sits between the lower-cost Cyclone/MAX families and the high-end Stratix family in the Intel FPGA hierarchy.
Key features of the 10AX115S3F45I2LG include: 1,150,000 logic elements for parallel data-path implementation; 68.86 Mb of embedded memory for packet buffering and lookup tables; up to 624 user I/O for wide memory-channel or backplane connectivity; on-die 14.1 Gbps / 28.05 Gbps-capable transceivers for PCIe Gen3, 10G/40G Ethernet, and CPRI; and hard memory controllers and variable-precision DSP blocks that reduce soft-logic overhead and power. The part is built on a TSMC 20 nm process and uses a 0.9 V core supply.
The 'F45' suffix indicates the 45 mm x 45 mm package body. The 'S3' suffix denotes the speed grade 3, while 'I2' indicates the industrial temperature grade and 'LG' denotes lead-free RoHS-compliant packaging. Designers should consult the official Arria 10 datasheet for transceiver counts, PLL counts, PCIe hard IP availability, and exact I/O bank breakdown for this OPN.
Typical applications include high-speed serial backplane aggregation, 100G/40G Ethernet line-card prototyping, radar and EW signal processing, 4K/UHD video processing, ASIC prototyping, and PCIe Gen3 root-complex or endpoint designs.
When designing with this device, pay particular attention to PCB stack-up, transceiver channel length matching, and thermal management - the 1932-ball FCBGA package has a high pin count and significant power dissipation under load. Use Intel Quartus Prime to compile, simulate, and place-and-route the device, and follow Intel's Arria 10 hardware-design guidelines for power-rail sequencing and PCB layout.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design considerations not found in the manufacturer datasheet.
Alternativas drop-in para 10AX115S3F45I2LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AX115S3F45I2LG (mesmo formato e footprint) — diferindo em Package, DSP Blocks, Speed Grade, Embedded Memory, Temperature Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AX115S3F45I2SG
✅ Drop-In✓ Em estoque
$2020 / unidade
Ver ficha técnica →10AX115S3F45E2LG
✅ Drop-In✓ Em estoque
$7950 / unidade
Ver ficha técnica →10AX115S2F45I2LG
✅ Drop-In✓ Em estoque
$3895 / unidade
Ver ficha técnica →10AX115S2F45I2SG
✅ Drop-In✓ Em estoque
$7100 / unidade
Ver ficha técnica →10AX115S3F45E2SG
✅ Drop-In✓ Em estoque
$6200 / unidade
Ver ficha técnica →10AX115S2F45E2LG
✅ Drop-In✓ Em estoque
$7100 / unidade
Ver ficha técnica →10AX115S1F45I1SG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →10AX115S3F45I2LG Classificações máximas e características elétricas
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,600 bits (68.86 Mb) |
| User I/O Count | 624 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Encapsulamento | 1932-BBGA, FCBGA (F45: 45x45 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (Industrial grade) |
| Temperature Grade | Industrial (I2) |
| Speed Grade | 3 (S3) |
| Transceivers | Up to 28.05 Gbps (per Arria 10 GX family) |
| DSP Blocks | Variable-precision (per family) |
| Status RoHS | Compliant (lead-free, LG suffix) |
| Design Tool | Intel Quartus Prime |
Guia de Configuração de Pinos do 10AX115S3F45I2LG 1932-bbga, fcbga (f45: 45x45 mm)
Configuração de pinos para 10AX115S3F45I2LG (pacote 1932-bbga, fcbga (f45: 45x45 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AX115S3F45I2LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AX115S3F45I2LG é adequado para 6 aplicaçãos: 100G/40G Ethernet Line Card, PCIe Gen3 Root Complex / Endpoint, Radar / EW Signal Processing, 4K/UHD Video Processing, ASIC Prototyping, High-Speed Serial Backplane Aggregation.
100G/40G Ethernet Line Card
The 10AX115S3F45I2LG fits 100G/40G Ethernet line-card prototypes because of its up to 28.05 Gbps transceivers and 1.15M logic elements that absorb MAC, PCS, and lookup-table functions. With 624 user I/O, the device can drive multiple QSFP28 cages and external DDR4 memory channels simultaneously. The 20 nm process and 0.9 V core supply reduce dynamic power versus prior 28 nm nodes, an important factor at line-card port densities. Designers use Quartus Prime with the Intel IP catalog to instantiate 100G Ethernet MAC, FEC, and RS-FEC hard IP directly on the transceiver channels. Compared with a Stratix 10 device, the Arria 10 GX is the price-optimized choice when absolute highest DSP performance is not required.
Recomendado
PCIe Gen3 Root Complex / Endpoint
The 10AX115S3F45I2LG suits PCIe Gen3 root-complex and endpoint designs because it integrates PCIe Gen3 hard IP blocks alongside the high-speed transceivers needed for x8/x16 link widths. With 1.15M logic elements and 68.86 Mb of embedded memory, the device can host multiple soft cores, DMA engines, and protocol bridges concurrently. Industrial temperature rating (I2 suffix) supports deployment in controlled-environment servers, test equipment, and embedded platforms. Use the Quartus Prime PCIe hard IP wizard to instantiate the endpoint or root-port controller. The Arria 10 family offers a balanced cost-performance point versus Cyclone 10 (too few) and Stratix 10 (over-spec for many Gen3 applications).
Recomendado
Radar / EW Signal Processing
The 10AX115S3F45I2LG is well-matched to radar and electronic-warfare signal processing because its variable-precision DSP blocks deliver high TOPS at the 20 nm node, while the transceiver array streams multi-GSPS ADC data into the FPGA fabric. With 1.15M LE and 68.86 Mb of on-chip memory, designers can implement pulse compression, moving-target indication, and adaptive beamforming without external memory for first-stage processing. Industrial temperature rating is appropriate for many ground- and surface-platform installations. The device's 0.9 V core and 20 nm process reduce thermal density relative to 28 nm predecessors. For airborne or extended-temp applications, prefer the E2 variant (10AX115S3F45E2LG).
Recomendado
4K/UHD Video Processing
The 10AX115S3F45I2LG fits 4K/UHD video processing because its wide memory bandwidth and large logic capacity can drive multiple display pipelines, scalers, and color-space converters in parallel. The 624 user I/O can connect to HDMI 2.0, DisplayPort 1.4, and SDI interfaces simultaneously, while the transceiver array handles SDI rates beyond 12 Gbps. Variable-precision DSP blocks accelerate video scaling and deinterlacing algorithms. Industrial temperature rating suits professional broadcast equipment and digital signage. Quartus Prime provides reference designs for common video pipelines, reducing time-to-prototype. For pure consumer-grade volume production, smaller Arria 10 devices may be more cost-effective.
Recomendado
ASIC Prototyping
The 10AX115S3F45I2LG is a strong ASIC prototyping vehicle because 1.15M logic elements and 68.86 Mb embedded memory can absorb multi-million-gate ASIC designs partitioned across one or two FPGAs. Industrial temperature rating suits benchtop and lab-deployed prototype hardware. Designers use Quartus Prime's ASIC prototyping flow and design-partitioning guidance to map RTL into the device. The 1932-ball FCBGA F45 package offers generous connectivity for high-pin-count prototypes. Compared with smaller 10AX066 or 10AX090 devices, the 10AX115 enables larger single-chip prototypes and reduces the need for multi-FPG partitioning.
Recomendado
High-Speed Serial Backplane Aggregation
The 10AX115S3F45I2LG fits backplane-aggregation line cards because its transceiver array and large logic capacity support multi-protocol bridging between 10G/40G/100G links. The 624 user I/O can connect to multiple SFP+/QSFP cages and to backplane SERDES channels. Industrial temperature rating suits controlled-environment telecom and datacom equipment. The 20 nm process and integrated hard IP minimize the soft-logic overhead and power of multi-protocol bridges. Designers use Quartus Prime's transceiver toolkit for signal-integrity tuning. For higher-density platforms with multiple 100G ports, two Arria 10 devices may replace one larger but more expensive Stratix 10 part.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AX115S3F45I2LG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AX115S3F45I2SG | 10AX115S3F45E2LG | 10AX115S2F45I2LG | 10AX115S2F45I2SG | 10AX115S3F45E2SG | 10AX115S2F45E2LG | 10AX115S1F45I1SG |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-BBGA FCBGA (F45) | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | 3 (S3) | 3 | 3 | 2 | 2 | 3 | 2 | 1 |
| Temperature Grade | Industrial (I2, -40C to +100C) | Industrial (I2) | Extended (E2, -40C to +125C) | Industrial (I2) | Industrial (I2) | Extended (E2) | Extended (E2) | Industrial (I1) |
| RoHS / Lead-Free | Yes (LG) | Yes (SG) | Yes (LG) | Yes (LG) | Yes (SG) | Yes (SG) | Yes (LG) | Yes (SG) |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
| Embedded Memory | 68.86 Mb | 68.86 Mb | 68.86 Mb | 68.86 Mb | 68.86 Mb | 68.86 Mb | 68.86 Mb | 68.86 Mb |
| User I/O | 624 | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
Principais diferenciais
- Largest Arria 10 GX density (1.15M LE) in 1932-ball FCBGA F45 package (vs 10AX090S3F45I2LG)
- Industrial temperature rating with full transceiver lineup (vs 10AX115S3F45E2LG)
- Speed grade 3 (highest) for maximum performance (vs 10AX115S2F45I2LG)
Notas de projeto
The 1932-ball FCBGA package dissipates significant power under full transceiver and logic utilization. Estimated: at 0.9 V core and 25-30 W typical application power, a high-performance thermal solution is required. Use Intel's Arria 10 thermal-management guidance: heatsink with thermal interface material, sufficient airflow, and a multi-layer PCB with a thermal-via array under the package. Measure junction temperature with the on-die temperature-sensing diode and apply the ALTIMA/SoC EDS thermal model.
The F45 1932-ball FCBGA requires a high-layer-count PCB (typically 12+ layers) with microvia or via-in-pad construction for the BGA escape. Maintain 100-ohm differential impedance for transceiver channels and 50-ohm single-ended for general-purpose I/O. Match transceiver trace lengths within the tolerance specified in the Arria 10 hardware-design guidelines. Place decoupling capacitors on the bottom side of the PCB directly under the package power balls for best high-frequency performance.
Use Intel's Arria 10 pin connection guidelines for unused pins, voltage references, and configuration pins. Decouple each power rail per the datasheet's recommended capacitor network, including bulk, mid-frequency, and high-frequency ceramic capacitors. Route high-speed transceivers on inner stripline layers with continuous reference planes. Avoid routing over plane splits in the transceiver channels - this is a common source of signal-integrity failures at 28 Gbps line rates.
Estimated: A common pitfall is failing to assign configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) per the datasheet before compiling in Quartus Prime. Another pitfall is assuming the Arria 10 power-up sequence is tolerant - the device requires specific rail sequencing per Intel's power-management guidelines. Verify configuration scheme (AS, PS, JTAG, FPP) matches the design's boot requirements. Always run the Quartus Prime Pin Planner and TimeQuest timing analyzer with the correct speed-grade and temperature-grade constraints before board bring-up.
Informações de conformidade
Lead-free RoHS-compliant per LG suffix in OPN. Industrial temperature grade (I2). Not AEC-Q100 qualified (FPGAs typically are not). REACH compliance per Intel product page.
