10CL025ZE144I8G - Cyclone 10 LP FPGA 25K LE 144-EQFP | Intel
N.º da peça: 10CL025ZE144I8G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $67.5 | $67,50 |
| 10 | $61.2 | $612,00 |
| 100 | $54.85 | $5.485,00 |
| 500 | $49.3 | $24.650,00 |
| 1.000 | $44.1 | $44.100,00 |
10CL025ZE144I8G Visão geral
What is a low-cost FPGA? A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect, with embedded memory, multipliers, phase-locked loops, and I/O cells. FPGAs are parallel-processing, hardware-reconfigurable ICs that sit between discrete microcontrollers and application-specific integrated circuits (ASICs) in the embedded hierarchy: microcontroller (software-driven, sequential) -> FPGA (hardware-parallel, reconfigurable) -> ASIC (fixed-function, lowest unit cost at volume). The Cyclone 10 LP family is Intel's (formerly Altera) low-power, low-cost FPGA line, succeeding the Cyclone IV and Cyclone V families.
Key features include 24,624 logic elements, 608,256 bits (76 KBytes) of embedded M9K SRAM blocks, 66 embedded 18x18 multipliers, four general-purpose PLLs, and 76 maximum user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability and a Configuration via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) interface.
The 10CL025ZE144I8G uses a TSMC 60 nm low-power process with a 1.0 V core supply and 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O bank support, providing a flexible logic density that consumes typically under 1.5 W for the EQFP-144 device. Configuration memory is volatile SRAM, requiring an external serial configuration flash such as EPCS16 or EPCQ16.
Typical applications include industrial motor control, video surveillance and image processing bridges, low-power industrial IoT edge nodes, portable medical device control logic, and LED display controllers. The Cyclone 10 LP family is pin-compatible with prior Cyclone IV E devices of the same density and package, easing migration paths.
When designing with the 10CL025ZE144I8G, ensure the exposed pad (EP) is soldered to a properly sized thermal copper pour with at least 4 thermal vias for heat dissipation; insufficient EP soldering will trigger thermal shutdown under sustained load. Use Intel Quartus Prime Lite Edition (free) for synthesis, place-and-route, and timing closure; larger designs may require the Standard edition.
This page synthesizes distributor pricing, drop-in equivalents from the Cyclone 10 LP and Cyclone IV E families, and practical design notes not consolidated in the manufacturer datasheet alone.
Alternativas drop-in para 10CL025ZE144I8G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL025ZE144I8G (mesmo formato e footprint) — diferindo em Embedded Memory, Logic Elements (LE), Operating Temperature, Family, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL025ZE144C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10CL025YE144I7G
✅ Drop-In✓ Em estoque
$35.8 / unidade
Ver ficha técnica →10CL025YE144I8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10CL016ZE144I8G
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →10CL010ZE144I8G
✅ Drop-In✓ Em estoque
$19.6 / unidade
Ver ficha técnica →10CL006ZE144I8G
✅ Drop-In✓ Em estoque
$35.88 / unidade
Ver ficha técnica →10CL025ZE144I8G Classificações máximas e características elétricas
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 24,624 |
| Configurable Logic Blocks (LABs) | 1539 |
| Embedded Memory | 608,256 bits (76 KBytes, M9K blocks) |
| Embedded 18x18 Multipliers | 66 |
| General-Purpose PLLs | 4 |
| Maximum User I/O Pins | 76 |
| Core Voltage | 1.0 V |
| Operating Supply Voltage (typical) | 1.0 V to 1.03 V |
| Encapsulamento / Caixa | 144-LQFP Exposed Pad (EQFP-144, 22x22 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +100 C (Industrial) |
| Speed Grade | 8 (I8G suffix) |
| Configuration Mode | JTAG, AS, AP, PS |
| Process Technology | 60 nm low-power CMOS |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 10CL025ZE144I8G 144-lqfp exposed pad (eqfp-144, 22x22 mm)
Configuração de pinos para 10CL025ZE144I8G (pacote 144-lqfp exposed pad (eqfp-144, 22x22 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CL025ZE144I8G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CL025ZE144I8G é adequado para 6 aplicaçãos: Industrial Motor Control (FOC, PFC), Video Surveillance Camera Bridge, Industrial IoT Edge Node Controller, Portable Medical Device Control Logic, LED Video Display Controller, Automotive Aftermarket Infotainment Bridge (non-AEC-Q100).
Industrial Motor Control (FOC, PFC)
The 10CL025ZE144I8G fits industrial motor-control drives because its 24,624 logic elements and 66 embedded 18x18 multipliers execute field-oriented control (FOC), space-vector PWM, and encoder decoding in hardware with deterministic sub-microsecond latency. The 76 user I/O pins support three-phase PWM outputs, Hall or quadrature encoder inputs, and RS-485/Modbus communication. The industrial -40 C to +100 C temperature rating tolerates drive-cabinet environments. Used as the central control law processor between a 24 V DC bus and a three-phase inverter stage, the device delivers deterministic current-loop bandwidth above 10 kHz. The 608 Kbits of embedded M9K SRAM is sufficient for FIR-filter-based current reconstruction and Park/Clarke transform tables.
Recomendado
Video Surveillance Camera Bridge
The 10CL025ZE144I8G acts as a sensor-to-network bridge for video surveillance and machine-vision cameras. Its LVDS-capable I/O and up to 76 user pins interface directly to MIPI-CSI-2 or parallel LVCMOS image sensors. The 66 embedded 18x18 multipliers accelerate convolution kernels (Sobel, Gaussian, sharpening) for edge pre-processing, and the 608 Kbits of embedded M9K SRAM provides line-buffer storage for 720p grayscale frames at 30 fps. The 1.0 V core and 60 nm low-power process keep total board power under 1.5 W, enabling fan-less sealed outdoor enclosures. Quartus Prime Lite DSP Builder accelerates algorithm development for fixed-point image pipelines.
Recomendado
Industrial IoT Edge Node Controller
The 10CL025ZE144I8G is well-suited as a programmable edge-controller for Industrial IoT gateways that aggregate Modbus, CAN, and EtherCAT fieldbus traffic. Its 24,624 logic elements implement the deterministic EtherCAT slave controller (ESC) state machine, while the 608 Kbits of embedded M9K SRAM buffer data frames between the fieldbus and an upstream Cortex-M4 host processor. The 1.0 V core supply and sub-1.5 W typical power allow fan-less operation in DIN-rail enclosures. Four general-purpose PLLs generate independent clocks for the EtherCAT PHY, the host-processor SPI bus, and an external ADC sampling clock. Industrial -40 C to +100 C rating tolerates factory-floor temperature swings.
Recomendado
Portable Medical Device Control Logic
The 10CL025ZE144I8G provides reliable, low-power control logic for portable medical devices such as infusion pumps, handheld patient monitors, and bedside ultrasound front ends. Its 24,624 logic elements implement safety-critical state machines, watchdog timers, and redundant fault-detection logic that meet IEC 62304 software-class B/C requirements when paired with appropriate firmware. The industrial -40 C to +100 C temperature rating and 1.0 V core supply fit battery-powered enclosures where heat dissipation is constrained. The 76 user I/O pins drive TFT LCDs, capacitive touch controllers, and isolated analog front ends. Low static current during AS configuration hold state preserves battery life between therapy sessions.
Recomendado
LED Video Display Controller
The 10CL025ZE144I8G drives large LED video walls by multiplexing hundreds of PWM channels for LED driver rows and columns. Its 76 maximum user I/O pins interface directly to HUB75 LED panel connectors and shift-register chains, and the 24,624 logic elements implement gamma-correction lookup tables, brightness-control PWM, and refresh-rate management for up to 32 scan lines. The 608 Kbits of embedded M9K SRAM buffer one full LED panel frame at 64x64 pixel resolution with 24-bit color depth. The industrial -40 C to +100 C rating handles outdoor display-cabinet environments. The 1.0 V core supply and 60 nm process keep total board power under 1.5 W, simplifying thermal design in sealed outdoor enclosures.
Recomendado
Automotive Aftermarket Infotainment Bridge (non-AEC-Q100)
The 10CL025ZE144I8G serves as a video and audio bridge in non-safety automotive aftermarket head units and rear-seat entertainment systems. Its 76 user I/O pins interface to LVDS LCD panels, HDMI receivers, and I2S audio CODECs, and the 24,624 logic elements implement color-space conversion and audio-sample-rate conversion in hardware. The 66 embedded 18x18 multipliers accelerate audio DSP and video scaling kernels. Industrial -40 C to +100 C rating handles cabin temperature extremes. For OEM safety-critical ECUs requiring AEC-Q100 qualification, the Cyclone 10 GX or MAX 10 family must be used instead because the 10CL025ZE144I8G is not AEC-Q100 qualified.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL025ZE144I8G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL025ZE144C8G | 10CL025YE144I7G | 10CL025YE144I8G | 10CL016ZE144I8G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 24,624 | 24,624 | 24,624 | 24,624 | 15,408 (-37%) |
| Embedded Memory (bits) | 608,256 | 608,256 | 608,256 | 608,256 | 504,576 (-17%) |
| Embedded 18x18 Multipliers | 66 | 66 | 66 | 66 | 56 (-15%) |
| Maximum User I/O Pins | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) |
| Speed Grade | 8 | 8 | 7 | 8 | 8 |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
Principais diferenciais
- Higher logic density in the 144-EQFP package than smaller-density Cyclone 10 LP siblings (vs 10CL016ZE144I8G)
- Industrial -40 C to +100 C temperature rating versus commercial-only siblings (vs 10CL025ZE144C8G)
- Speed grade 8 (faster) versus speed grade 7 (slower) at same density (vs 10CL025YE144I7G)
- 60 nm low-power process versus prior Cyclone IV E at 60 nm process (similar but newer device family) (vs EP4CE22E144I7N (Cyclone IV E))
Notas de projeto
Estimated: at 100% logic utilization with all 66 multipliers running at 200 MHz in the EQFP-144 package, typical power is approximately 1.5 W. Solder the exposed pad (EP) to a continuous copper pour of at least 25 mm x 25 mm on the top layer with 4 to 9 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to inner ground planes. Without adequate EP soldering, junction temperature can rise 30 C to 50 C above ambient and trigger thermal shutdown under sustained DSP workloads.
Power the 10CL025ZE144I8G from a low-noise LDO or DC-DC regulator; the core supply (VCCINT) must be 1.0 V with +/-30 mV tolerance, while VCCA (PLL analog) must be 2.5 V filtered through a ferrite bead. Decoupling requires 100 nF X7R ceramic capacitors within 5 mm of every VCC pin, plus 10 uF bulk capacitors on VCCINT and VCCIO rails. The 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V I/O banks each require their own decoupling per I/O bank.
Route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) away from switching signals and adjacent to the JTAG header. Match the length of the LVDS pairs to within 1 mm and route each pair with 100 ohm differential impedance. Use at least 4 PCB layers with continuous ground planes on layers 2 and 4 to minimize crosstalk on the parallel I/O bus. For JTAG, route TCK with a 33 ohm series-termination resistor near the FPGA.
Do not leave the exposed pad (EP) floating or insufficiently soldered; this is the most common cause of thermal-shutdown failure in the EQFP package. Always include an external configuration flash (EPCS16 or EPCQ16) because the 10CL025ZE144I8G uses volatile SRAM configuration memory and will not retain the bitstream through a power cycle. Ensure MSL handling per J-STD-033 (Moisture Sensitivity Level); the device must be baked before reflow if the humidity indicator card shows out-of-spec exposure.
Enable the on-chip series-termination (RS OCT) and parallel-termination (RT OCT) features for I/O signals running above 50 MHz to suppress reflections. Use the Quartus Prime board-level signal-integrity tool to verify that overshoot and undershoot stay within 0.3 V of the VCCIO rail. For LVDS channels, enable the on-chip 100 ohm differential-termination and route each pair with 100 ohm +/-10% controlled impedance over a continuous reference plane.
Informações de conformidade
RoHS and REACH compliant per Intel Cyclone 10 LP product compliance documentation. Lead-free and halogen-free mold compound. NOT AEC-Q100 qualified - the Cyclone 10 LP family is positioned for industrial and consumer applications. For automotive safety-critical ECUs, consider the Cyclone 10 GX or MAX 10 (-A suffix) families.
