A3PE1500-FGG48C - 1.5M-Gate ProASIC3E Flash FPGA | Actel
N.º da peça: A3PE1500-FGG48C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 500 | $106.2 | $53.100,00 |
| 1.000 | $96.8 | $96.800,00 |
A3PE1500-FGG48C Visão geral
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM plus an external configuration ROM. Within the programmable logic hierarchy, the FPGA sits above CPLDs and PAL/GAL devices, and the ProASIC3E family is a single-chip, live-at-power-up solution: no external boot device is required, which reduces bill-of-material cost, board area, and configuration-time security exposure compared with SRAM FPGAs.
Key differentiating features of the A3PE1500 include its reprogrammable flash fabric supporting optional soft ARM Cortex-M-based processor implementations, single-chip operation with inherent secure FPGA capability, and low total cost of ownership as highlighted on the Microchip product page. The device supports abundant advanced features typical of the ProASIC3E family, including embedded memory blocks and flexible I/O standards.
Architecturally, the fabric is built from VersaTiles - a fine-grained three-input logic element that can implement combinational and sequential functions - fabricated on a standard CMOS flash process. On-chip flash routing and configuration storage eliminate configuration loading and support instant-on behavior, while the family datasheet documents performance suitable for glue logic consolidation, bus bridging, and control-plane functions.
Typical applications include industrial automation control, aerospace and defense subsystem logic, communications line-card bridging, and portable instrumentation where a single-chip, secure, non-volatile FPGA lowers system cost. The 484-ball BGA provides sufficient I/O for wide parallel buses and memory interfaces.
When designing with the A3PE1500-FGG48C, verify commercial temperature suitability (0C to +70C for the C suffix); industrial applications should select the I-suffix variant, which shares the same die and footprint. Power distribution and BGA decoupling should follow the manufacturer datasheet power supply recommendations.
This page synthesizes distributor sourcing data, same-family drop-in temperature and speed-grade variants, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para A3PE1500-FGG48C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE1500-FGG48C (mesmo formato e footprint) — diferindo em Package, System Gates, Temperature Grade, Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE1500-FGG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE1500-FGG48I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$55.4 / unidade
Ver ficha técnica →A3PE1500-2FGG484Y
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE1500-2FGG484
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3PE1500-FGG484
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3PE1500-FGG48C Classificações máximas e características elétricas
| Family | ProASIC3E Flash FPGA |
| System Gates | 1,500,000 |
| Logic Elements (VersaTiles) | 38,400 |
| User I/O | 280 |
| Embedded Flash (routing/configuration) | 276,480 bits |
| Configuration Type | Flash (single-chip, live at power-up) |
| Encapsulamento | 484-ball FGG (Fine-Pitch BGA) |
| Tipo de montagem | Surface Mount |
| Temperature Grade | Commercial (C) |
| Soft Processor Support | Optional soft ARM support |
| Reprogrammability | Yes (in-system flash reprogrammable) |
| Status RoHS | unknown |
| Security Feature | Flash-based secure FPGA (no external bitstream) |
| Technology | CMOS flash process |
Guia de Configuração de Pinos do A3PE1500-FGG48C 484-ball fgg (fine-pitch bga)
Configuração de pinos para A3PE1500-FGG48C (pacote 484-ball fgg (fine-pitch bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE1500-FGG48C.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE1500-FGG48C é adequado para 6 aplicaçãos: Industrial Automation Control, Aerospace and Defense Subsystem Logic, Communications Line-Card Bridging, Test and Measurement Instrumentation, Secure Embedded Control, Legacy Board Repair and Sustainment.
Industrial Automation Control
The A3PE1500-FGG48C fits industrial automation controllers where a single-chip flash FPGA consolidates PLC I/O sequencing, encoder interfacing, and fieldbus glue logic. Its 1,500,000 gates and 38,400 VersaTiles absorb large state machines, while 280 user I/Os handle wide parallel sensor and actuator buses that smaller CPLDs cannot. Because configuration resides in on-chip flash, the controller boots instantly at power-up with no external configuration device to fail in electrically noisy factory environments. The commercial C temperature grade suits cabinet-mounted equipment; select the I-suffix variant for floor-mounted gear exceeding 70C. Instant-on flash configuration also simplifies safety-related deterministic startup sequences required in motion-control commissioning.
Recomendado
Aerospace and Defense Subsystem Logic
ProASIC3E flash FPGAs are a long-standing choice in defense electronics because the flash fabric is single-chip and inherently secure: no external bitstream is ever exposed on the bus, unlike SRAM FPGAs. The A3PE1500-FGG48C provides 1.5M gates for telemetry formatting, bus bridging (MIL-STD-1553 glue, ARINC interfaces), and payload sequencing with 280 I/Os. Live-at-power-up behavior matters in avionics where power-on-to-functional time is monitored. Note the C suffix is a commercial grade - flight programs should use industrial or military temperature variants of the same die. The 484-ball BGA supports the high pin-count interfaces typical of backplane cards, and reprogrammability supports in-field capability updates without hardware change.
Recomendado
Communications Line-Card Bridging
In telecom and datacom line cards, the A3PE1500-FGG48C bridges backplane buses to PHY devices, manages frame-buffer control logic, and implements housekeeping state machines. Its 276,480 embedded flash bits and fabric memory handle control tables, while 1.5M gates implement multiple parallel bridge channels. The flash fabric's deterministic instant-on avoids the multi-hundred-millisecond SRAM FPGA configuration window, letting the card participate in rapid system bring-up - valuable in redundant, hot-swappable architectures. Designers should budget I/O banks across the 484-ball BGA for the mixed-voltage interfaces common on line cards and follow datasheet power sequencing recommendations for multi-rail operation.
Recomendado
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE1500-FGG48C for trigger engines, timing generators, and data-path formatting between converters and processors. The 38,400 VersaTiles implement high-fan-in comparators and timestamping counters, while the 280 available I/Os connect to ADC/DAC front ends over wide parallel buses. Flash configuration guarantees the instrument is ready before the operator interface completes initialization, and the reprogrammable fabric allows feature upgrades in the field via JTAG - important for instruments with long service lives. The commercial C grade fits laboratory environments; verify thermal budget within a closed chassis since the 484-ball BGA dissipates power across the full fabric utilization range.
Recomendado
Secure Embedded Control
Applications requiring design IP protection benefit from ProASIC3E's flash security model: the configuration lives on-chip, so there is no external PROM to clone and no bitstream to intercept during loading. The A3PE1500-FGG48C can host a soft ARM-based controller alongside custom logic using its optional soft ARM support, giving a single-chip control node with 1.5M gates of application fabric. This suits smart sensors, encrypted comms front ends, and anti-tamper subsystems. Designers should still implement the datasheet-recommended flash lock features and follow Microchip security guidance, since the commercial C grade is intended for benign environments; pair with a secure boot chain in the host system.
Recomendado
Legacy Board Repair and Sustainment
For end-of-life industrial, medical, and communications equipment, the A3PE1500-FGG48C is frequently procured for board-level repair where the original design cannot be migrated. Because all A3PE1500 variants share the same 484-ball FGG footprint and die, a commercial unit can often be substituted for a failed part after temperature-grade verification, and the industrial A3PE1500-FGG484I can replace the C part in harsher service. The original Libero project can be recompiled and programmed into the replacement flash fabric, preserving bit-level behavior. Sustainment teams should qualify the independent-distributor supply chain, given this mature part is not broadly franchised.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE1500-FGG48C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE1500-FGG484I | A3PE1500-2FGG484Y | A3PE1500-FGG484 |
|---|---|---|---|---|
| Package | 484-ball FGG BGA | 484-ball FGG BGA - same | 484-ball FGG BGA - same | 484-ball FGG BGA - same |
| Brand | Actel (Microsemi/Microchip) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| User I/O | 280 | 280 | 280 | 280 |
| Temperature Grade | Commercial (C) | Industrial (I) | Commercial (per Microchip USA listing) | Commercial |
| Speed Grade | Standard | Standard | 2 (faster) | Standard |
| Configuration | Flash, single-chip, live at power-up | Flash, single-chip, live at power-up | Flash, single-chip, live at power-up | Flash, single-chip, live at power-up |
| Primary Use Case | Cost-driven commercial logic consolidation | Extended-temperature industrial/defense | Timing-critical high-performance designs | General commercial designs |
Principais diferenciais
- Single-chip flash configuration with no external boot device (vs SRAM FPGAs of the same era (e.g., Xilinx Spartan-3))
- Pin-identical industrial variant available (vs A3PE1500-FGG484I)
- Speed upgrade path without redesign (vs A3PE1500-2FGG484Y)
Notas de projeto
The ProASIC3E die uses multiple supply rails (core and I/O banks per the family datasheet). Estimated: total power scales with fabric utilization and toggle rate, so run Microchip's power calculator with your Libero post-layout netlist before fixing the board's regulator budget. Decouple each rail at the BGA with an array of 0.1 uF ceramics plus bulk capacitance per the datasheet power-supply recommendations, and honor the documented power-up sequencing between rails to avoid excessive inrush into the flash fabric.
The 484-ball FGG BGA requires a controlled-impedance multilayer stackup; fan out with via-in-pad or dog-bone escape per IPC BGA land-pattern practice as referenced by the package mechanical drawing. Assign I/O banks before routing so mixed-voltage standards stay within the same bank, and reserve JTAG programming access on a test header even in production - in-system reprogramming is a key maintenance benefit of the flash family. Keep configuration-related pins per datasheet strap recommendations.
A frequent sourcing pitfall is treating A3PE1500-FGG48C as interchangeable with any A3PE1500 suffix: the C suffix is commercial temperature, so substituting it into an industrial-design socket (or vice versa without verification) risks reliability failures in the field. Also confirm the speed grade needed for timing closure before ordering - the '2' graded parts close tighter timing. Finally, legacy designs should be recompiled in a current Libero release to pick up any tooling fixes rather than blindly reusing old programming files.
Informações de conformidade
Compliance status not stated in provided web data; verify on the Microchip product page environmental datasheet before export-controlled or RoHS-sensitive builds.
