A42MX09-3TQG176I - 14K Gate MX FPGA, 104 I/O | Microchip
N.º da peça: A42MX09-3TQG176I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.9 | $389,00 |
| 100 | $34.75 | $3.475,00 |
| 500 | $31.2 | $15.600,00 |
| 1.000 | $28.4 | $28.400,00 |
A42MX09-3TQG176I Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that designers configure after manufacturing. Within the programmable logic hierarchy, the MX family sits in the low-cost, high-volume tier of FPGAs, which in turn belong to the broader category of programmable logic devices (PLDs), alongside CPLDs and structured ASICs.
The key differentiator of the MX family is its antifuse programmable interconnect architecture. Unlike SRAM-based FPGAs that require a configuration device at every power-up, the antifuse fabric is programmed once and becomes permanent, providing instant-on operation, inherently high design security, and no configuration readback risk. This makes the A42MX09 a reliable single-chip ASIC alternative for integrating legacy PLD designs into one low-cost device.
The 5.0V-tolerant, flexible architecture of the MX family supports 5V and 3.3V I/O environments that dominate legacy industrial backplanes, while the -3 speed grade denotes the fastest commercially supported performance bin for this die. With 14K system gates and 104 I/Os, the device addresses glue logic consolidation, bus interfacing, state machines, and control-plane functions.
Typical applications include industrial automation control, legacy PLD consolidation, military/aerospace control boards, and high-volume embedded systems where non-volatile, tamper-resistant logic is required without external configuration flash.
When designing with the A42MX09-3TQG176I, note that the industrial (I) suffix guarantees -40C to +85C operation, whereas the non-suffixed commercial part is rated 0C to +70C; choose accordingly for the thermal environment. Antifuse programming requires the dedicated Microchip programming flow and cannot be reworked in-field.
This page synthesizes distributor pricing, same-package drop-in alternatives across the MX family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A42MX09-3TQG176I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A42MX09-3TQG176I (mesmo formato e footprint) — diferindo em Package, System Gates, Family, Supply Voltage, Configuration.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A42MX09-3TQG176
✅ Drop-In✓ Em estoque
$32.1 / unidade
Ver ficha técnica →A42MX09-2TQG176I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A42MX09-TQG176M
✅ Drop-In✓ Em estoque
$58.75 / unidade
Ver ficha técnica →A42MX09-TQG176A
✅ Drop-In✓ Em estoque
$32.1 / unidade
Ver ficha técnica →A42MX16-1TQG176I
✅ Drop-In✓ Em estoque
$29.9 / unidade
Ver ficha técnica →A42MX16-2TQG176I
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A42MX24-1TQG176
✅ Drop-In✓ Em estoque
$28.75 / unidade
Ver ficha técnica →A42MX09-3TQG176I Classificações máximas e características elétricas
| Family | MX FPGA (antifuse) |
| System Gates | 14000 |
| Number of I/O | 104 |
| Supply Voltage (Core/IO Rail 1) | 3 V to 3.6 V |
| Supply Voltage (Rail 2) | 4.75 V to 5.25 V |
| Speed Grade | -3 |
| Programming Technology | Antifuse (one-time programmable) |
| Encapsulamento | 176-TQFP (24x24 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial, I suffix) |
| Status RoHS | ROHS3 Compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 10 weeks |
| Product Status | Active |
| Configuration | Non-volatile, no external configuration device required |
| Architecture | 5.0 V flexible MX architecture |
Guia de Configuração de Pinos do A42MX09-3TQG176I 176-tqfp (24x24 mm)
Configuração de pinos para A42MX09-3TQG176I (pacote 176-tqfp (24x24 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A42MX09-3TQG176I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A42MX09-3TQG176I é adequado para 6 aplicaçãos: Legacy PLD Consolidation, Industrial Automation Control, Single-Chip ASIC Alternative / High-Volume Embedded Systems, Aerospace and Defense Control Boards, 5V Legacy Backplane Interface, Security-Critical Logic and Anti-Cloning.
Legacy PLD Consolidation
The A42MX09-3TQG176I is purpose-built for integrating legacy PLDs, PALs, and small CPLDs into a single low-cost antifuse FPGA. Its flexible 5.0 V architecture supports the 5V (4.75V to 5.25V) and 3.3V (3V to 3.6V) I/O environments common on aging industrial boards, eliminating level-shift circuitry. With 14,000 system gates and 104 user I/Os, several discrete logic devices can be absorbed into one package, cutting BOM count and board area. Because the antifuse fabric is non-volatile, no configuration flash is needed, preserving the instant-on behavior of the original PLD design.
Recomendado
Industrial Automation Control
In industrial automation, the A42MX09-3TQG176I provides glue logic, bus interfacing, and state-machine control between PLC modules, motor drives, and sensor nodes. The industrial -40C to +85C rating of the I-suffixed part is essential on factory floors, and the 104 I/Os handle parallel fieldbus and backplane interfaces natively at 5V levels. The -3 speed grade supports fast combinational decode and sequenced control outputs, while the one-time-programmable fabric resists configuration corruption from EMI and brownouts - a real risk for SRAM FPGAs in electrically noisy switch-cabinet environments. Lead time is 10 weeks, so production schedules should secure stock early.
Recomendado
Single-Chip ASIC Alternative / High-Volume Embedded Systems
Microchip positions the MX family as a reliable, single-chip ASIC alternative for high-volume products. The A42MX09-3TQG176I delivers mask-ASIC-like permanence - the antifuse interconnect is hard-programmed once - without ASIC NRE charges or long mask lead times. Its 14K gates and 104 I/Os suit control-plane logic, address decode, and protocol bridges in embedded controllers. Designers implement the design once, program production devices, and ship with confidence that the logic cannot be altered, cloned via configuration readback, or corrupted in the field, making it attractive for cost-sensitive, high-volume embedded platforms where design IP protection matters.
Recomendado
Aerospace and Defense Control Boards
The MX antifuse architecture has a long heritage in aerospace and defense electronics, where immunity to configuration upsets and radiation-tolerant qualification flows matter. The A42MX09-3TQG176I's permanently programmed fabric contains no external bitstream to protect and no SRAM cells to upset, and screened variants such as the A42MX09-TQG176M address military-grade flows in the identical 176-TQFP footprint. Typical uses include telemetry framing, sensor-glue logic, power-sequencing controllers, and bus interfaces on avionics boards. Engineers should select the M- or A-suffixed screening grades for programs with formal part-quality requirements rather than the standard industrial part.
Recomendado
5V Legacy Backplane Interface
Many installed telecom, test, and industrial chassis still run 5V TTL backplanes that modern SRAM FPGAs cannot tolerate. The A42MX09-3TQG176I natively supports the 4.75V to 5.25V rail, allowing direct connection to TTL-level backplane signals through its 104 user I/Os. Acting as a protocol translator, address decoder, or interrupt controller between an aging backplane and a modern 3.3V processor section, the device bridges two voltage domains in one chip. Its instant-on, non-volatile configuration also means the board is functional the moment power is applied, matching the behavior of the original TTL/PLD designs being replaced or upgraded.
Recomendado
Security-Critical Logic and Anti-Cloning
Because antifuse FPGAs carry no external configuration image and offer no readback of the programmed netlist, the A42MX09-3TQG176I is well suited to security-critical logic: authentication blocks, key-handling state machines, and anti-cloning gates on payment, access-control, and licensing boards. An attacker who captures the PCB cannot extract the design from the device the way configuration flash or SRAM bitstreams can be dumped. With 14K gates there is room for moderate cryptographic glue around a dedicated secure MCU. The trade-off is that any design update requires physically replacing programmed devices, so freeze the logic before volume production.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A42MX09-3TQG176I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A42MX09-3TQG176 | A42MX09-2TQG176I | A42MX16-2TQG176I | A42MX24-1TQG176 |
|---|---|---|---|---|---|
| Package | 176-TQFP (24x24 mm) | 176-TQFP - same | 176-TQFP - same | 176-TQFP - same | 176-TQFP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -3 | -3 | -2 | -2 | -1 |
| Operating Temperature | -40C to +85C (I) | 0C to +70C | -40C to +85C | -40C to +85C | 0C to +70C |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Principais diferenciais
- Fastest MX09 speed grade with industrial temperature (vs A42MX09-3TQG176)
- Same-die upgrade path when gates run out (vs A42MX16-2TQG176I)
- Non-volatile instant-on antifuse fabric (vs SRAM-based FPGAs)
Notas de projeto
The A42MX09-3TQG176I requires two supply rails: 3V to 3.6V (typically 3.3V) and 4.75V to 5.25V (5V) per the Microchip MX family data. Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10 uF per rail. Antifuse FPGAs draw no configuration current at power-up, but inrush into decoupling and I/O loads should still be characterized. Estimated: budget rail current by simulating your netlist, since MX static and dynamic current depend heavily on toggle rates.
Antifuse devices are one-time programmable: a mistake in the design cannot be reworked in the device. Complete full timing simulation and static timing analysis at the -3 speed grade in Microchip Libero/Designer before programming any production unit. Also note the VPP programming-voltage pin must be handled exactly as the MX family datasheet specifies during programming; in-circuit programming fixtures must expose it. Never substitute the commercial 0C to +70C A42MX09-3TQG176 in a design that can drop below freezing.
The 176-TQFP (24x24 mm) has 0.5 mm pin pitch; use a solder-mask-defined land pattern per IPC-7351 recommendations and verify paste aperture reduction to avoid bridging on this legacy-pitch package. Keep global clock (GCLK) routing on the dedicated GCLK pins listed in the MX datasheet - driving clocks through general fabric inputs degrades skew and timing closure at the -3 grade. Assign unused I/O per the datasheet default and tie unused inputs, since floating inputs increase noise susceptibility on 5V-tolerant banks.
Informações de conformidade
ROHS3 Compliant per Microchip USA / distributor data. REACH, halogen-free and conflict-minerals declarations not stated in provided data - request formal compliance package from Microchip.
