A54SX32-1CQ208M - 48K-Gate SX FPGA 208-CQFP | Microchip
N.º da peça: A54SX32-1CQ208M ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $66.2 | $6.620,00 |
| 500 | $60.9 | $30.450,00 |
| 1.000 | $55.75 | $55.750,00 |
A54SX32-1CQ208M Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing, sitting within the broader hierarchy of programmable logic below system-on-chip devices but above simple SPLDs and CPLDs. The Actel SX family uses a sea-of-modules architecture with antifuse interconnect, meaning the configuration is hard-wired at programming time rather than stored in volatile SRAM, so the device powers up instantly with no external configuration ROM and offers inherent resistance to configuration upset.
Key features include 32,000 typical gates (up to 48,000 system gates), 1800 cells organized as 2880 C-cells and R-cells in the sea-of-modules fabric, dual-voltage operation supporting 3.0V to 3.6V core and 4.75V to 5.25V I/O, and 0.35 micron CMOS process technology supporting clock rates up to 240 MHz. The 174 user-I/O pins support both 3.3V and 5V signaling, easing mixed-voltage legacy system integration.
Technically, the SX architecture separates dedicated clock resources and high-speed routing from the module fabric, enabling predictable, ASIC-like timing. Because antifuse programming is one-time, the device suits production designs where volatility, security against bitstream theft, and instant-on behavior matter more than in-field reconfigurability.
Typical applications include industrial control, military and aerospace interfaces, communications line cards, test equipment, and glueless bridge logic between 5V legacy systems and 3.3V subsystems. The commercial temperature range (-part suffix 1C, 0C to +70C) targets cost-sensitive industrial and commercial deployments.
Design consideration: antifuse FPGAs cannot be reprogrammed; reserve adequate I/O and gate margin (20-30%) before committing the design, since design changes require a new device. This page synthesizes verified distributor data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A54SX32-1CQ208M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A54SX32-1CQ208M (mesmo formato e footprint) — diferindo em Family, Package, System Gates, Logic Modules, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A54SX32-CQ208M
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A54SX32-CQ208B
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A54SX32-CQ208
✅ Drop-In✓ Em estoque
$1545.45 / unidade
Ver ficha técnica →A54SX32-1CQG208M
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A54SX32A-1CQ208M
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A54SX32-1CQ208M Classificações máximas e características elétricas
| Family | Actel SX (54SX) |
| System Gates | 48000 |
| Typical Gates | 32000 |
| Logic Cells | 1800 |
| Logic Modules | 2880 |
| User I/O | 174 |
| Maximum Toggle/Performance | 240 MHz |
| Process Technology | 0.35 um CMOS |
| Core Supply Voltage | 3 V to 3.6 V (3.3 V nominal) |
| I/O Supply Voltage | 4.75 V to 5.25 V (5 V) / 3.3 V compatible |
| Programming Technology | Antifuse (one-time programmable) |
| Speed Grade | -1 |
| Temperatura de operação | 0 C to +70 C (commercial) |
| Encapsulamento | 208-pin CQFP (BFCQFP with tie bar), ceramic |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do A54SX32-1CQ208M 208-pin cqfp (bfcqfp with tie bar), ceramic
Configuração de pinos para A54SX32-1CQ208M (pacote 208-pin cqfp (bfcqfp with tie bar), ceramic). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A54SX32-1CQ208M.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A54SX32-1CQ208M é adequado para 6 aplicaçãos: Industrial Control and Automation, Communications Line Cards, Test and Measurement Equipment, 5V Legacy System Bridge Logic, Secure and Anti-Tamper System Logic, Avionics and Defense Subsystems (Grade-Dependent).
Industrial Control and Automation
The A54SX32-1CQ208M fits industrial control because its 174 user I/O with 5V-tolerant signaling interfaces directly to legacy PLC I/O racks, sensor banks, and motor-controller logic that still run at 5V TTL levels, while the 3.3V core keeps power dissipation manageable. The antifuse fabric powers up instantly with the factory-programmed design, eliminating configuration-boot delay that SRAM FPGAs impose on safety-relevant machines. With 2880 logic modules and 240 MHz class performance, it integrates state machines, counters, and interface glue that would otherwise need multiple CPLDs and discrete logic. Designers should reserve 20-30% logic and I/O margin since the device is one-time programmable, and verify industrial ambient conditions against the 0C to +70C commercial rating.
Recomendado
Communications Line Cards
In telecom and datacom line cards, the A54SX32-1CQ208M's 240 MHz class performance and dedicated clock routing support high-speed framing, multiplexing, and backplane interface logic. The sea-of-modules architecture gives ASIC-like predictable timing on critical paths such as Sonet/SDH-overhead processing or T1/E1 aggregation glue, tasks for which the SX family was originally targeted. The 174 I/O accommodate wide parallel data buses to PHY and framer devices, and ceramic CQFP packaging improves thermal and mechanical robustness in racks running continuously. Because the antifuse configuration is immutable, deployed cards resist configuration corruption in the field. Verify per-path timing in Libero against the -1 speed grade tables and budget for the commercial 0C to +70C range in equipment-room deployments.
Recomendado
Test and Measurement Equipment
Bench and automated test instruments benefit from the A54SX32-1CQ208M's instant-on antifuse configuration - the instrument is ready the moment power is applied, with no configuration download latency between measurements. The 32K-gate (48K system gate) capacity implements pattern generators, timing controllers, trigger logic, and bus interface state machines, while 174 I/O connect to stimulus/measurement front ends operating at both 3.3V and 5V levels. The 240 MHz class fabric timing supports fast counter/timer and edge-detection functions, and the ceramic CQFP-208 package maintains stable electrical characteristics under repeated thermal cycling typical of lab duty. Design teams should program margin analysis into their test-head reuse strategy since design changes require new devices.
Recomendado
5V Legacy System Bridge Logic
A primary SX-family use case is glueless bridging between legacy 5V TTL systems and modern 3.3V subsystems: the A54SX32-1CQ208M's I/O supports both 4.75V-5.25V and 3.0V-3.6V domains, letting one device translate voltage domains, buffer buses, and implement address decoding simultaneously. This removes level-shifter arrays that discrete solutions require, reducing BOM count and board area while the 240 MHz fabric handles fast bus turnaround. The antifuse design is immune to configuration upsets from brownouts common in aging 5V backplanes, and instant-on behavior means the bridge is active before host reset completes. Keep the 0C to +70C commercial rating in scope and confirm I/O current per pin against SX family DC specifications.
Recomendado
Secure and Anti-Tamper System Logic
Because the antifuse interconnect physically fuses the configuration into the die with no readable bitstream stored externally, the A54SX32-1CQ208M is well suited to systems where design IP must be protected: encryption key handling front ends, proprietary protocol engines, and licensing logic. Unlike SRAM FPGAs, there is no configuration file to intercept at power-up, and no external configuration PROM footprint to attack. The 48K system gates accommodate AES-class datapaths or custom cipher wrappers around host processors, and 174 I/O connect sensors, switches, and zeroization lines in tamper-detection trees. Note the commercial temperature rating limits deployment; defense programs should specify the military-grade 'M' temperature variant of the same die in CQFP-208.
Recomendado
Avionics and Defense Subsystems (Grade-Dependent)
The SX32 die in the ceramic CQFP-208 package has a long service history in avionics and defense subsystems - bus interface adapters, discrete-to-digital converters, and redundancy management logic - owing to the ceramic package's hermeticity and the antifuse fabric's immunity to configuration SEU. Designers targeting these programs should select the -I or -M temperature variants of the same A54SX32 device, since the -1C part is limited to 0C to +70C, and pair it with the appropriate Military-Mil/Aerospace qualification documentation from Microchip. The 240 MHz fabric timing supports fast voting and bit-error checking, and 174 I/O cover MIL-STD-1553 and ARINC-style discrete interfaces implemented in logic. Instant-on behavior simplifies brownout recovery in power-interrupted platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A54SX32-1CQ208M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A54SX32-CQ208M | A54SX32-CQ208B | A54SX32-CQ208 | A54SX32-1CQG208M | A54SX32A-1CQ208M |
|---|---|---|---|---|---|---|
| Package | 208-pin CQFP (BFCQFP with tie bar) | 208-CQFP - same | 208-CQFP - same | 208-CQFP - same | 208-CQFP (green variant) - same footprint | 208-BFCQFP with tie bar - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 (32K typical) | 48000 (32K typical) | 48000 (32K typical) | 48000 (32K typical) | 48000 (32K typical) | 48000 (32K typical) |
| User I/O | 174 | 174 | 174 | 174 | 174 | 174 |
| Speed Grade | -1 | Standard | Different grade combination | Standard | -1 | -1 (SX-A timing tables) |
| Process Technology | 0.35 um CMOS | 0.35 um CMOS | 0.35 um CMOS | 0.35 um CMOS | 0.35 um CMOS | 0.25 um CMOS |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C | Grade per 'B' suffix designation | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
Principais diferenciais
- Fastest grade in the CQFP-208 family variant (vs A54SX32-CQ208M)
- Identical die with green encapsulation option (vs A54SX32-1CQG208M)
- 0.35 um process timing predictability vs SX-A successor (vs A54SX32A-1CQ208M)
Notas de projeto
Antifuse devices are one-time programmable: any functional change requires a new programmed device. Before release, hold 20-30% spare logic modules and I/O in the design, simulate the full gate-level netlist, and run static timing in Microchip Libero (Designer) against the -1 speed grade tables. Do not rely on typical datasheet 240 MHz figures for your own critical paths - actual performance depends on routing fanout and placement.
The A54SX32-1CQ208M requires a 3.0V to 3.6V core supply; if the board also uses 5V I/O signaling, provide separate 5V (4.75V-5.25V) rail per the SX family power-pin grouping on the 208-pin CQFP. Decouple each supply domain with at least 0.1 uF ceramic capacitors at the package power pins plus bulk 10 uF. Estimated: with 2880 modules active at moderate toggle rates, core current typically remains in the tens-of-mA range, but confirm with the datasheet power calculator for your netlist.
The ceramic CQFP with tie bar requires careful land-pattern design and reflow profiles: the tie bar must be soldered or mechanically secured per the package drawing in the Microchip 54SX datasheet to relieve package stress. Use an exact JEDEC-derived CQFP-208 footprint from the Microchip design support files, and inspect solder joints on all four sides with X-ray or AOI, since gull-wing leads on ceramic packages are prone to lifted-lead defects in handling.
Informações de conformidade
Ceramic CQFP hermetic package typical of legacy Microsemi aerospace-grade packaging; the A54SX32-1CQG208M variant exists specifically as a green-encapsulation option. Confirm RoHS/REACH status with Microchip product pages before export-controlled or EU-market designs.
