A54SX32A-1FGG256M - 48K-Gate SX-A FPGA, 256-BGA | Microchip
N.º da peça: A54SX32A-1FGG256M ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82.4 | $824,00 |
| 100 | $74.9 | $7.490,00 |
| 500 | $68.2 | $34.100,00 |
| 1.000 | $62.5 | $62.500,00 |
A54SX32A-1FGG256M Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure after manufacturing. Within the programmable-logic hierarchy - FPGA -> programmable logic device -> digital IC - antifuse FPGAs like the SX-A are one-time-programmable (OTP): configuration is permanently written, giving inherent resistance to configuration readback attacks and no need for an external configuration flash, which improves system reliability and security compared to SRAM FPGAs.
Key features include the sea-of-modules architecture built from two logic module types: the C-cell (combinatorial) and R-cell (register), providing essentially lossless floorplan area utilization. The -1 speed grade balances performance and cost, the 256-FPBGA footprint supports high-density surface-mount assembly, and the wide 2.25V to 5.25V supply tolerance plus military-grade temperature rating make it suitable for harsh environments. RoHS3 compliance (the M suffix denotes moisture-sensitivity/lead-free flow per distributor listings) supports modern assembly processes.
Architecturally, the SX-A covers the entire die with a grid of logic modules and routing, so virtually no chip area is lost to interconnect. The 32K-gate-class A54SX32A die (marketed at 48K system gates) integrates multiple glue-logic, interface, and control functions into a single low-cost chip, replacing multi-chip PAL/GAL/ASIC solutions and reducing board area, power, and BOM cost.
Typical applications include aerospace and defense control logic, industrial automation controllers, communications interface bridging, and test equipment, where one-time programmability, instant-on startup, and tamper resistance matter more than reprogrammability.
Design consideration: because SX-A devices are OTP, verify your design thoroughly in simulation (Libero SoC / Designer flow) before programming; there is no design iteration on the same silicon, so account for the approximately 20-week manufacturer lead time in your procurement plan.
This page synthesizes distributor inventory and pricing signals, same-package drop-in variants, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas drop-in para A54SX32A-1FGG256M — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A54SX32A-1FGG256M (mesmo formato e footprint) — diferindo em Package, System Gates, Operating Temperature, RoHS Status, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A54SX32A-1FGG256I
✅ Drop-In✓ Em estoque
$316.27 / unidade
Ver ficha técnica →A54SX32A-1FGG256
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →A54SX32A-2FGG256I
✅ Drop-In✓ Em estoque
$368.59 / unidade
Ver ficha técnica →A54SX32A-FGG256A
✅ Drop-In✓ Em estoque
$295.2 / unidade
Ver ficha técnica →A54SX32A-BGG329M
✅ Drop-In✓ Em estoque
$97.6 / unidade
Ver ficha técnica →A54SX32A-1FGG256M Classificações máximas e características elétricas
| Family | SX-A (Actel antifuse FPGA) |
| System Gates | 48000 |
| Logic Modules | C-cell (combinatorial) and R-cell (register) |
| Architecture | Sea-of-modules, one-time programmable antifuse |
| Number of I/Os | 203 |
| Tensão de alimentação | 2.25 V to 5.25 V |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -1 |
| Temperatura de operação | -55C to +125C (TC) |
| Encapsulamento | 256-BGA (256-FPBGA, 17x17 mm) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Programmability | One-Time Programmable (antifuse) |
| Status RoHS | ROHS3 Compliant |
| Lead Free Status | Lead Free |
| Product Status | Active |
| Manufacturer Lead Time | 20 weeks |
Guia de Configuração de Pinos do A54SX32A-1FGG256M 256-bga (256-fpbga, 17x17 mm)
Configuração de pinos para A54SX32A-1FGG256M (pacote 256-bga (256-fpbga, 17x17 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A54SX32A-1FGG256M.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A54SX32A-1FGG256M é adequado para 6 aplicaçãos: Aerospace and Defense Control Logic, Industrial Automation and PLC I/O, Communications Interface Bridging, Test and Measurement Equipment, Medical Device Control Electronics, Security and Camera System Logic.
Aerospace and Defense Control Logic
The A54SX32A-1FGG256M fits aerospace and defense control applications because it combines a -55C to +125C military temperature rating with one-time-programmable antifuse configuration that has no readback path, supporting anti-tamper and IP-protection requirements common in defense programs. The 48K system gates and 203 user I/Os are sufficient to integrate address decoders, bus interfaces, and state machines that would otherwise require several PAL/GAL devices. In use, the FPGA powers up instantly with the configured function - no configuration flash load time and no external configuration device, improving boot reliability in radiation-adjacent and high-vibration environments. The trade-off is OTP rigidity: designs must be fully verified in simulation before programming, and the roughly 20-week lead time demands early procurement in program schedules.
Recomendado
Industrial Automation and PLC I/O
In industrial controllers, the A54SX32A-1FGG256M integrates I/O decoding, encoder interfaces, and interlock logic into one 256-FPBGA chip, replacing multi-chip glue logic and cutting board area and assembly cost. Its wide 2.25V to 5.25V supply tolerance bridges 2.5V, 3.0V, and 3.3V rails typical of mixed-voltage PLC backplanes, and the -55C to +125C rating tolerates cabinet hot spots near drives and power electronics that exceed industrial-grade limits. Because antifuse configuration is permanent, the logic behaves identically at every cold start - valuable for safety interlocks that must be active the instant power is applied, with no bootloader or configuration-load window. Designers should budget I/O bank voltages per the SX-A datasheet and prefer the -1 speed grade when timing margins allow, since it is the lowest-cost option in the family.
Recomendado
Communications Interface Bridging
The SX-A architecture's fast C-cell/R-cell fabric suits protocol bridging between legacy buses and modern interfaces. With 48K gates and 203 I/Os, the A54SX32A-1FGG256M can implement parallel-to-serial adaptors, custom FIFO control, and address translation between backplane standards and point-to-point links. The sea-of-modules routing gives relatively predictable delays for -1 grade designs running in the tens-of-MHz regime typical of bridge functions, and the antifuse fabric draws no configuration current and exhibits low static power, beneficial in always-on telecom line cards. In deployment, the OTP device sits between processors and transceivers, enabling system-wide savings by integrating multiple discrete logic functions into a single low-cost chip - exactly the integration argument Microchip makes for SX-A. Verify I/O standards (3.3V CMOS/TTL-compatible banks) against the SX-A datasheet before pin planning.
Recomendado
Test and Measurement Equipment
Bench and automated test instruments use the A54SX32A-1FGG256M for scan chains, trigger logic, and timing generators where deterministic one-time-programmable behavior simplifies calibration across production units. The 48K-gate capacity handles pattern generators and comparator-lane control, while 203 I/Os interface with ADC/DAC front ends over 3.3V logic banks within the 2.25V to 5.25V supply envelope. Because there is no configuration device, instruments reach a defined logic state immediately at power-up, avoiding measurement artifacts during the configuration window that SRAM FPGAs introduce. The 256-FPBGA 17x17 mm package keeps the logic close to front-end circuitry, shortening critical timing paths. Engineering teams should fix pin assignments early and lock simulations, since OTP silicon cannot be updated in the field if protocol requirements change.
Recomendado
Medical Device Control Electronics
Diagnostic and laboratory medical equipment benefits from the A54SX32A-1FGG256M's fixed-function reliability: the antifuse configuration cannot be corrupted by single-event upsets of configuration memory, and instant-on logic ensures motors, shutters, and safety interlocks behave deterministically from power application - relevant to equipment safety cases. The 48K gates integrate sensor sequencing, alarm logic, and host interfaces in one chip; the 2.25V to 5.25V supply range and 203 I/Os accommodate mixed 2.5V/3.3V analog-front-end domains. The -55C to +125C rating comfortably exceeds medical ambient requirements, adding margin for enclosed, fanless assemblies that run warm. Designers normally select this part where long-lifecycle availability and configuration immutability outweigh field-upgradability; if firmware-style updates are required, an SRAM FPGA or microcontroller supervisory path should be added alongside.
Recomendado
Security and Camera System Logic
Surveillance and access-control hardware uses the A54SX32A-1FGG256M as tamper-resistant glue logic: because the antifuse bitstream cannot be read back, attackers cannot extract logic designs from deployed units, a property SRAM FPGAs cannot match without encrypted bitstream management. Typical roles include camera timing generation, keypad/relay matrix scanning, and watchdog supervision, well within 48K gates and 203 I/Os. The wide supply tolerance simplifies power design across 2.5V to 3.3V camera modules, and instant-on behavior means the system is protected from the first millisecond of power, with no configuration-load vulnerability window. For deployments outdoors, verify the installation's ambient against the -55C to +125C case rating. Note the OTP constraint: security logic should be finalized and simulation-verified before ordering, given the approximately 20-week lead time.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A54SX32A-1FGG256M — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A54SX32A-1FGG256I | A54SX32A-1FGG256 | A54SX32A-2FGG256I | A54SX32A-BGG329M |
|---|---|---|---|---|---|
| Package | 256-FPBGA (17x17 mm) | 256-FPBGA (17x17) - same | 256-FPBGA (17x17) - same | 256-FPBGA (17x17) - same | 329-BGA - different |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48 K | 48 K | 48 K | 48 K | 48 K |
| Speed Grade | -1 | -1 | -1 | -2 (faster) | -1 |
| Supply Voltage | 2.25 V to 5.25 V | 2.25 V to 5.25 V | 2.25 V to 5.25 V | 2.25 V to 5.25 V | 2.25 V to 5.25 V |
| Programming Technology | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Principais diferenciais
- Military temperature range on the standard 256-FPBGA footprint (vs A54SX32A-1FGG256I)
- Lowest-cost speed grade for timing-comfortable designs (vs A54SX32A-2FGG256I)
- OTP antifuse security with no configuration device (vs Any SRAM FPGA)
Notas de projeto
The SX-A family is one-time programmable: once the antifuse array is blown there is no design iteration on the same silicon. Complete gate-level simulation with SDF back-annotation in the Microchip Libero SoC/Designer flow, verify timing at the -1 speed grade corner including temperature and voltage derating across 2.25V-5.25V, and only then release the programming file. Given the approximately 20-week manufacturer lead time, a missed verification step can set a program back a full quarter.
Power the I/O banks and core within the 2.25V to 5.25V envelope stated in distributor data, but treat the SX-A datasheet per-pin limits (VCCA, VCCI) as authoritative - I/O bank standards constrain the usable combinations below the absolute envelope. Antifuse FPGAs draw no configuration current and have no in-rush configuration surge, so bulk capacitance requirements are modest; still, decouple each supply ball with 0.1uF ceramics placed within 2 mm of the ball via short vias to the internal plane.
The 256-FPBGA (17x17 mm) uses approximately 1.0 mm ball pitch with perimeter plus partial-array balls; fan out with via-in-pad or dog-bone escape on the outer two rows and route inner balls on inner layers. Follow the tray moisture-sensitivity labeling - bake per standard BGA practice if floor life is exceeded before lead-free reflow (peak approximately 245-260C). Use the manufacturer land-pattern data from the SX-A package drawing rather than third-party footprints.
When migrating between the FGG256 variants listed here (M, I, base, -2), the footprint is unchanged, so lock your pin assignment once and qualify multiple ordering options in the same layout. This hedges supply risk: if military-grade M stock slips, the industrial -1FGG256I drops onto the same board after a temperature-derating review of your application's worst case.
Informações de conformidade
ROHS3 Compliant and lead free per Microchip USA product listing. REACH, halogen-free, and conflict-minerals status not stated in provided data. Military temperature grade; not an automotive AEC-Q100 program.
