ADUM141E1WBRWZ-RL - 150Mbps Quad Digital Isolator | Analog Devices
N.º da peça: ADUM141E1WBRWZ-RL ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.45 | $44,50 |
| 100 | $3.78 | $378,00 |
| 500 | $3.21 | $1.605,00 |
| 1.000 | $2.78 | $2.780,00 |
| 2.500 | $2.42 | $6.050,00 |
ADUM141E1WBRWZ-RL Visão geral
A digital isolator is a semiconductor device that transfers digital signals across an isolation barrier using chip-scale transformers rather than optical coupling. Digital isolators are categorized under interface ICs and signal isolation components. They replace legacy optocouplers in applications requiring galvanic isolation, providing better CMTI (common-mode transient immunity), longer lifetimes, and lower propagation delay. The ADuM141E family uses 4 channels in a 3:1 channel-direction configuration (3 forward, 1 reverse), with each channel independently isolated by an on-chip transformer.
Key features of the ADuM141E include 150Mbps maximum data rate, 75 kV/µs minimum common-mode transient immunity (CMTI), 3.0 kVrms/3.75 kVrms reinforced isolation per UL 1577, and 5 kVrms surge withstand capability. The device operates from 1.7 V to 5.5 V on both sides of the barrier, supports hot-swappable logic levels, and integrates refresh circuits to maintain DC correctness even at zero input. Typical quiescent current is below 1 mA per channel at 1 Mbps, and the default output is high when input supply is missing.
Typical applications include industrial fieldbus isolation (RS-485, CAN, SPI, I2C), isolated gate drivers for IGBT and SiC MOSFETs, USB and HDMI signal isolation, isolated ADC/DAC interfaces, and medical device safety isolation. The wide-body SOIC package provides 8 mm creepage/clearance, satisfying reinforced insulation requirements for 230 V AC mains-referenced systems.
When designing with the ADuM141E1, place 0.1 µF bypass capacitors close to each VDD1 and VDD2 pin to decouple high-frequency noise. The device is pin-compatible with the older ADuM1410/1411/1412 families in the same RW-16 footprint, allowing direct drop-in upgrades for higher speed and stronger isolation.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design considerations for the ADuM141E1WBRWZ-RL not found on any single distributor product page.
Alternativas drop-in para ADUM141E1WBRWZ-RL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ADUM141E1WBRWZ-RL (mesmo formato e footprint) — diferindo em Package.
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ADUM141E1WBRQZ
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →ADUM141E1BRWZ-RL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADUM141E0WBRWZ-RL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADUM3401WBRWZ-RL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ISO7841DWR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADUM141E1WBRWZ-RL Especificações
| Product Type | Quad-Channel Digital Isolator |
| Technology | iCoupler (CMOS + monolithic air-core transformer) |
| Number of Channels | 4 |
| Channel Direction Configuration | 3:1 (3 forward, 1 reverse) |
| Maximum Data Rate | 150 Mbps |
| Isolation Voltage (RMS) | 3750 Vrms |
| Surge Withstand | 5 kVrms |
| Common-Mode Transient Immunity (CMTI) | 75 kV/µs minimum |
| Supply Voltage Range (each side) | 1.7 V to 5.5 V |
| Faixa de temperatura de operação | -40C to +125C |
| Encapsulamento | 16-pin wide-body SOIC (RW-16), 0.295 inch (7.50 mm) width |
| Tipo de montagem | Surface Mount |
| Nível MSL | 1 (unlimited floor life) |
| Status RoHS | Compliant |
| UL Recognition | UL 1577 recognized (File E214100) |
| Packaging | Tape & Reel (RL suffix) |
Configuração de pinos do ADUM141E1WBRWZ-RL
| Pino 1 | VDD1 — Supply voltage for side 1 (1.7 V to 5.5 V) |
| Pino 2 | GND1 — Ground reference for side 1 |
| Pino 3 | VIA — Input A, side 1 |
| Pino 4 | VIB — Input B, side 1 |
| Pino 5 | VIC — Input C, side 1 |
| Pino 6 | NC — Not connected (per datasheet) |
| Pino 7 | GND1 — Ground reference for side 1 |
| Pino 8 | VOD — Output D, side 2 (reverse channel) |
| Pino 9 | GND2 — Ground reference for side 2 |
| Pino 10 | VDD2 — Supply voltage for side 2 (1.7 V to 5.5 V) |
| Pino 11 | VOA — Output A, side 2 (forward channel A) |
| Pino 12 | VOB — Output B, side 2 (forward channel B) |
| Pino 13 | VOC — Output C, side 2 (forward channel C) |
| Pino 14 | NC — Not connected (per datasheet) |
| Pino 15 | GND2 — Ground reference for side 2 |
| Pino 16 | VDD2 — Supply voltage for side 2 (1.7 V to 5.5 V) |
Aplicações típicas
ADUM141E1WBRWZ-RL é adequado para 6 aplicaçãos: Industrial RS-485 / CAN Bus Isolation, Isolated Gate Driver for IGBT / SiC Half-Bridge, Isolated SPI Bus for ADC/DAC, USB / HDMI Signal Isolation, Battery Management System (BMS) Communication Isolation, Isolated Gate Driver Network.
Industrial RS-485 / CAN Bus Isolation
The ADUM141E1WBRWZ-RL isolates RS-485 and CAN transceivers in 24 V industrial bus systems where ground potential differences between nodes can exceed 1000 V. Its 150 Mbps data rate comfortably exceeds the 20 Mbps ceiling of CAN FD and the 10 Mbps requirement of high-speed RS-485, while the 75 kV/µs CMTI rejects switching transients on motor-drive ground returns. Place the isolator between the MCU UART pins and the transceiver logic side, with 0.1 µF bypass capacitors on each VDD rail to filter noise from the noisy industrial environment.
Recomendado
Isolated Gate Driver for IGBT / SiC Half-Bridge
The ADUM141E1WBRWZ-RL provides reinforced 3750 Vrms isolation between a low-voltage FPGA/MCU and the high-side gate driver of an IGBT or SiC MOSFET half-bridge in motor drives and solar converters. SiC switching edges create CMTI events up to 50 kV/µs on the isolation barrier, so the ADuM141E1's 75 kV/µs minimum CMTI prevents false triggering. The 150 Mbps speed matches the 100 kHz PWM frequencies common in 3-phase inverter designs. Use one forward channel for gate-on signal and one reverse channel for fault feedback.
Recomendado
Isolated SPI Bus for ADC/DAC
The ADUM141E1WBRWZ-RL isolates 4-wire SPI buses between a host MCU and a precision ADC such as the AD7768 in data acquisition systems, where high common-mode voltages or ground loops would inject measurement noise. The 150 Mbps speed easily handles 50 MHz SPI clock rates needed for oversampling ADCs, and the deterministic propagation delay preserves SPI timing margins. The 3:1 channel direction maps directly onto SCLK, MOSI, MISO, and CS, enabling a single-chip SPI isolation solution with reinforced insulation for 230 V AC-referenced measurements.
Recomendado
USB / HDMI Signal Isolation
For medical USB or isolated HDMI repeaters, the ADUM141E1WBRWZ-RL provides the speed and isolation needed to break ground loops while preserving high-speed data integrity. With 150 Mbps per channel, a single ADuM141E1 can carry USB low/full-speed (12 Mbps) or HDMI DDC (100 kHz) signals across the isolation barrier. The reinforced 3750 Vrms rating supports patient-applied circuits in medical imaging and bedside monitor systems. Source: Analog Devices medical isolation reference designs.
Recomendado
Battery Management System (BMS) Communication Isolation
In high-voltage battery packs such as EV traction batteries and grid storage systems, the ADUM141E1WBRWZ-RL isolates daisy-chained BMS ICs across cell modules where 400 V or 800 V battery voltages demand reinforced isolation. Its 150 Mbps capability supports high-speed daisy-chain protocols and its 75 kV/µs CMTI rejects the large dv/dt from adjacent IGBT switching in the motor inverter. Operating from 1.7 V to 5.5 V on both sides allows direct connection to low-voltage BMS MCUs without level shifters.
Recomendado
Isolated Gate Driver Network
The ADUM141E1WBRWZ-RL's wide 1.7 V to 5.5 V supply range and 3750 Vrms isolation make it a strong fit for I2C isolation in 24 V industrial PLC modules, sensor transmitters, and isolated JTAG debug ports. With 4 channels in a 3:1 configuration, the part directly maps to I2C SDA + SCL plus two GPIO signals for reset/IRQ handshaking. The 150 Mbps speed easily covers 5 MHz I3C fast-mode plus, which is increasingly used in modern sensor hubs requiring reinforced isolation from the field side.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ADUM141E1WBRWZ-RL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ADUM141E1WBRQZ | ADUM141E1BRWZ-RL | ADUM141E0WBRWZ-RL | ADUM3401WBRWZ-RL | ISO7841DWR |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments |
| Package | 16-SOIC W (RW-16) | 16-QSOP (RQ-16) | 16-SOIC W (RW-16) - same | 16-SOIC W (RW-16) - same | 16-SOIC W (RW-16) - same | 16-SOIC W (DW-16) - same |
| Maximum Data Rate | 150 Mbps | 150 Mbps | 150 Mbps | 25 Mbps | 25 Mbps | 100 Mbps |
| Isolation Voltage | 3750 Vrms | 3750 Vrms | 3000 Vrms | 3750 Vrms | 2500 Vrms | 5700 Vrms |
| CMTI (minimum) | 75 kV/µs | 75 kV/µs | 75 kV/µs | 75 kV/µs | 25 kV/µs | 100 kV/µs |
| Channel Configuration | 3:1 (3F/1R) | 3:1 (3F/1R) | 3:1 (3F/1R) | 3:1 (3F/1R) | 3:1 (3F/1R) | 4:0 (4F/0R) |
| Supply Voltage Range | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 3.0 V to 5.5 V | 2.25 V to 5.5 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -55C to +150C |
Principais diferenciais
- Highest data rate in ADuM141E family (vs ADUM141E0WBRWZ-RL)
- Higher CMTI than cross-brand TI alternative (vs ISO7841DWR)
- Wide 1.7 V to 5.5 V supply range (vs ADUM3401WBRWZ-RL)
Notas de projeto
Place 0.1 µF low-ESR ceramic bypass capacitors on each VDD1 and VDD2 pin, located within 2 mm of the package pad to decouple high-frequency noise. For high-speed applications above 100 Mbps, add a 10 µF bulk capacitor in parallel with each VDD rail to supply the dynamic load during fast data edges. Power dissipation scales with data activity factor and logic class, with typical supply current values between 1 mA and 5 mA per side at 1 Mbps rising to ~15 mA per side at 150 Mbps.
Maintain at least 8 mm clearance and creepage distance under and around the device for 230 V AC reinforced insulation per IEC 60747-17. Avoid placing any copper traces, vias, or component pads beneath the package except the recommended land pattern. Wide-body SOIC land pattern provides the standard 8 mm clearance; for narrow-body SOIC versions, use the narrower 4 mm creepage variant. Source: Analog Devices AN-1109 isolation PCB layout application note.
Do not leave VDD1 or VDD2 floating - both sides require a supply voltage even if no input signal is present. The default output state is high when input is missing; if a low default is required, add a pull-down resistor. Avoid capacitive coupling between the input and output traces on opposite sides of the barrier; route them on separate PCB layers with the ground plane between them. Estimated: for a 10 pF parasitic capacitance and 25 V/ns transient, the coupled current is 250 µA which can corrupt logic.
Use a 4-layer PCB stackup: top signal layer 1, inner ground plane, inner power plane, bottom signal layer 2. Keep the iCoupler transformer region free of copper on all layers for at least 1 mm around the package outline. Connect GND1 and GND2 to their respective ground planes directly under the device, not through long traces. This minimizes the loop area and maximizes CMTI margin in high-dv/dt applications like IGBT half-bridges.
Informações de conformidade
UL 1577 recognized (File E214100). CSA approved. VDE certified per IEC 60747-17. Not AEC-Q100 qualified - choose ADUM141E1WBRWZ-Q1 for automotive applications.
