ATSAM3N00AA-MUR - 48MHz Cortex-M3 MCU 16KB Flash | Microchip
N.º da peça: ATSAM3N00AA-MUR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.07 | $3,07 |
| 10 | $2.82 | $28,20 |
| 100 | $2.55 | $255,00 |
| 500 | $2.35 | $1.175,00 |
| 1.000 | $2.15 | $2.150,00 |
ATSAM3N00AA-MUR Visão geral
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest tier of the embedded processing hierarchy that spans from MCUs to application processors. Microcontrollers execute dedicated control tasks in real time, making them the workhorses of embedded electronics. The SAM3N family belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio, positioning itself as a cost-optimized 32-bit upgrade path from 8-bit AVR and PIC architectures.
Key features of the ATSAM3N00AA include the high-performance 32-bit ARM Cortex-M3 RISC core with nested vectored interrupt controller (NVIC), a 12-channel 10-bit ADC, USART, UART, SPI and Two-Wire Interface (TWI) serial peripherals, PWM timers, and brown-out reset with watchdog supervision. The flash memory supports in-system programming, and the device supports the Serial Wire Debug (SWD) and JTAG interfaces for development.
The Cortex-M3 architecture delivers Thumb-2 code density, single-cycle multiply hardware, and deterministic interrupt latency, allowing efficient C-level programming through ARM-standard toolchains such as Keil MDK, IAR Embedded Workbench, and Microchip's free MPLAB X / Atmel Studio ecosystem with the SAM D/N Xplained family of evaluation kits.
Typical applications include industrial sensor nodes, consumer appliance control, stepper and DC motor control, battery-powered meters, and general-purpose 32-bit control systems where a low pin count, low power, and low BOM cost matter more than large flash capacity.
When designing with this MCU, budget the modest 16KB flash carefully: use compiler size optimization (-Os) and consider the pin-compatible, higher-flash SAM3N variants for code growth headroom.
This page synthesizes distributor pricing, same-package upgrade alternatives, pinout, and practical design guidance not found in the manufacturer datasheet.
Alternativas drop-in para ATSAM3N00AA-MUR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM3N00AA-MUR (mesmo formato e footprint) — diferindo em Core Processor, Core Size, Supply Voltage Range, ADC Resolution, Number of I/O.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM3N0AA-MU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3N1AA-MU
✅ Drop-In✓ Em estoque
$3.18 / unidade
Ver ficha técnica →ATSAM3N2AA-MU
✅ Drop-In✓ Em estoque
$7.35 / unidade
Ver ficha técnica →ATSAM3N00AA-MUR Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-bit single-core |
| Frequência máxima de clock | 48 MHz |
| Program Memory Size | 16 KB (16K x 8) FLASH |
| RAM Size | 4 KB |
| Supply Voltage Range | 1.62 V to 3.6 V (1.8V/2.5V/3.3V operation) |
| Encapsulamento | 48-VFQFN Exposed Pad, 7x7 mm |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount |
| Peripherals | Brown-out Detect/Reset, PWM, WDT |
| Connectivity | USART, UART, SPI, TWI (I2C) |
| ADC Resolution | 10-bit |
| Debug Interfaces | JTAG, Serial Wire Debug (SWD) |
| Termination Form | No Lead (HVQCCN) |
| Status RoHS | Compliant (GREEN package per Mouser) |
Configuração de pinos do ATSAM3N00AA-MUR
| Pino 1 | PB0 — General purpose I/O port B line 0 (multiplexed with peripheral functions per datasheet) |
| Pino 2 | PB1 — General purpose I/O port B line 1 |
| Pino 3 | PB2 — General purpose I/O port B line 2 |
| Pino 4 | PB3 — General purpose I/O port B line 3 |
| Pino 5 | PB4 — General purpose I/O port B line 4 |
| Pino 6 | PB5 — General purpose I/O port B line 5 |
| Pino 7 | PB6 — General purpose I/O port B line 6 |
| Pino 8 | PB7 — General purpose I/O port B line 7 |
| Pino 9 | PB8 — General purpose I/O port B line 8 |
| Pino 10 | PB9 — General purpose I/O port B line 9 |
| Pino 11 | PB10 — General purpose I/O port B line 10 |
| Pino 12 | PB11 — General purpose I/O port B line 11 |
| Pino 13 | PB12 — General purpose I/O port B line 12 |
| Pino 14 | PB13 — General purpose I/O port B line 13 |
| Pino 15 | GND — Ground |
| Pino 16 | VDDCORE — Core power supply |
| Pino 17 | VDDIO — I/O power supply |
| Pino 18 | PC0 — General purpose I/O port C line 0 |
| Pino 19 | PC1 — General purpose I/O port C line 1 |
| Pino 20 | PC2 — General purpose I/O port C line 2 |
| Pino 21 | PC3 — General purpose I/O port C line 3 |
| Pino 22 | PC4 — General purpose I/O port C line 4 |
| Pino 23 | PC5 — General purpose I/O port C line 5 |
| Pino 24 | PC6 — General purpose I/O port C line 6 |
| Pino 25 | PC7 — General purpose I/O port C line 7 |
| Pino 26 | PC8 — General purpose I/O port C line 8 |
| Pino 27 | PC9 — General purpose I/O port C line 9 |
| Pino 28 | PC10 — General purpose I/O port C line 10 |
| Pino 29 | PC11 — General purpose I/O port C line 11 |
| Pino 30 | PC12 — General purpose I/O port C line 12 |
| Pino 31 | PC13 — General purpose I/O port C line 13 |
| Pino 32 | PC14 — General purpose I/O port C line 14 |
| Pino 33 | PC15 — General purpose I/O port C line 15 |
| Pino 34 | PC16 — General purpose I/O port C line 16 |
| Pino 35 | PC17 — General purpose I/O port C line 17 |
| Pino 36 | VDDIO — I/O power supply (second pin) |
| Pino 37 | PA0 — General purpose I/O port A line 0 (multiplexed with USART/SPI/TWI/ADC functions) |
| Pino 38 | PA1 — General purpose I/O port A line 1 |
| Pino 39 | PA2 — General purpose I/O port A line 2 |
| Pino 40 | PA3 — General purpose I/O port A line 3 |
| Pino 41 | PA4 — General purpose I/O port A line 4 |
| Pino 42 | PA5 — General purpose I/O port A line 5 |
| Pino 43 | PA6 — General purpose I/O port A line 6 |
| Pino 44 | PA7 — General purpose I/O port A line 7 |
| Pino 45 | PA8 — General purpose I/O port A line 8 |
| Pino 46 | XIN/XOUT/NRST/TEST/ERASE/TDI/TDO/TMS/TCK — Analog, reset and debug multiplexed pins - exact assignment per SAM3N datasheet pin table |
| Pino 47 | AD0-AD7 — Analog input channels multiplexed with GPIO - exact assignment per SAM3N datasheet pin table |
| Pino 48 | GND / EP — Ground / exposed pad - solder to PCB ground plane for thermal and electrical performance |
Aplicações típicas
ATSAM3N00AA-MUR é adequado para 6 aplicaçãos: Industrial Sensor Nodes, Consumer Appliance Control, Stepper and DC Motor Control, Battery-Powered Metering, UART/SPI Protocol Bridges, Embedded Training and Prototyping.
Industrial Sensor Nodes
The ATSAM3N00AA-MUR fits industrial sensor nodes where a 10-bit ADC, SPI, and TWI interfaces must condition and digitize analog signals before transmission. Its Cortex-M3 core at 48 MHz provides ample processing headroom for filtering and protocol formatting, while 16KB flash accommodates compact sensor-fusion or averaging firmware. Low-power modes allow nodes to sleep between sampling events, extending battery life in wired-free installations. The 48-QFN exposed-pad package offers good thermal and ground performance on vibration-prone machinery, and the industrial -40C to +85C rating suits factory floor enclosures.
Recomendado
Consumer Appliance Control
Home appliances such as coffee machines, fans, and small pumps benefit from the ATSAM3N00AA-MUR's combination of PWM timers, watchdog supervision, and brown-out reset for safe AC-adjacent control logic. The 48 MHz Cortex-M3 executes button debouncing, display multiplexing, and closed-loop motor control in a single inexpensive 32-bit device, replacing multi-chip 8-bit solutions. Its 1.62V to 3.6V supply range interfaces directly with common 3.3V logic, and the 48-pin QFN footprint keeps PCB area small inside cost-driven housings. Green, RoHS-compliant packaging meets consumer environmental regulations.
Recomendado
Stepper and DC Motor Control
The SAM3N00A's PWM channels and multiple timers make it a compact controller for stepper and brushed DC motors. Firmware in the 16KB flash can implement microstepping tables, acceleration ramps, and current-limit logic, with the 10-bit ADC reading back shunt current or potentiometer position for closed-loop operation. The Cortex-M3's deterministic interrupt response keeps PWM jitter low at 48 MHz operation. Communication via USART or SPI links the motor controller to a higher-level PLC or host, and the industrial temperature grade tolerates driver-cabinet heat near power electronics.
Recomendado
Battery-Powered Metering
Utility sub-meters and portable measurement instruments exploit the ATSAM3N00AA-MUR's 1.62V minimum supply and sleep-mode current savings to maximize battery service life. The 10-bit ADC samples current-shunt or voltage-divider inputs, while the USART streams readings to a wireless module or optical probe. With only 4KB SRAM, firmware must be lean, but simple metrology accumulation algorithms fit comfortably in 16KB flash. The exposed-pad QFN aids heat dissipation for sustained ADC operation, and the industrial temperature range supports outdoor meter enclosures from cold climates to hot equipment rooms.
Recomendado
UART/SPI Protocol Bridges
Legacy equipment often needs translation between RS-232/RS-485 serial links, SPI peripherals, and I2C sensors. The ATSAM3N00AA-MUR integrates USART, UART, SPI, and TWI on one chip, letting 16KB of flash hold bidirectional buffer code and CRC/error checking with room to spare. Its 48 MHz Cortex-M3 core sustains full-duplex throughput with low latency, and DMA-free polling designs remain simple given the small peripheral count. The 3.3V I/O tolerates level-shifter front ends, and the 48-QFN package suits compact DIN-rail and gateway PCBs.
Recomendado
Embedded Training and Prototyping
Universities and engineering teams use the ATSAM3N00AA-MUR as an entry point into 32-bit ARM development: the Cortex-M3 is the industry-standard teaching core, and Microchip's free toolchain (MPLAB X with SAM-family support) plus SWD debugging keeps startup costs near zero. The 48-pin QFN can be mounted on breakout boards, and its peripherals (ADC, PWM, TWI, USART) cover the full breadth of a first embedded course. Firmware written for the 16KB part ports directly to the pin-compatible 32KB and 64KB SAM3N variants, giving students a growth path.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM3N00AA-MUR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM3N0AA-MU | ATSAM3N1AA-MU | ATSAM3N2AA-MU |
|---|---|---|---|---|
| Package | 48-QFN 7x7 mm (VFQFN, EP) | 48-QFN 7x7 mm - same | 48-QFN 7x7 mm - same | 48-QFN 7x7 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Format | Tape & Reel (R suffix) | Tray | Tray | Tray |
Principais diferenciais
- Lowest memory density in the SAM3N family with correspondingly lowest cost (vs ATSAM3N2AA-MU)
- Reel packaging for automated high-volume assembly (vs ATSAM3N0AA-MU)
- 32-bit ARM Cortex-M3 ecosystem at 8-bit price point (vs ATMEGA8A-MUR)
Notas de projeto
The 48-QFN exposed pad must be soldered to a grounded PCB thermal pad. Use a 4x4 via array (0.3 mm vias) under the exposed pad connecting to the internal ground plane to guarantee both thermal performance and a low-impedance ground return. For assembly, stencil apertures at 60-70% coverage with segmentation prevent voiding under the pad, which can cause rework and intermittent ground issues on no-lead packages.
Decouple each VDDIO pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the supply entry. VDDCORE requires its own decoupling per the SAM3N datasheet power scheme; do not tie VDDCORE to VDDIO externally - the device integrates its own core regulator topology. Verify the 1.62V minimum supply is met during brown-out events: the integrated brown-out detector holds the core in reset below the safe threshold.
Budget the 16KB flash conservatively: enable compiler size optimization (-Os) and link with a flash-reserve margin of at least 15% for bugfix updates. QFN pins are multiplexed; assign peripheral functions early in schematic capture using the datasheet multiplexing tables, because some functions (e.g., certain USART/ADC lines) appear on only one pin. Program the device via SWD on the production line - reserve a 5-pin SWD header (SWDIO, SWCLK, NRST, GND, VTG) even in cost-optimized layouts.
Keep the XIN/XOUT crystal traces short (under 10 mm), guard them with ground, and place the crystal load capacitors close to the pins. Route the 10-bit ADC inputs away from PWM and clock traces; use a local ground pour under analog routing. Estimated: at 3.3V and tens of mA of I/O load, junction dissipation stays well under 100 mW, so thermal design is dominated by the exposed pad rather than power copper.
Informações de conformidade
Mouser listing describes the package as 'QFN, GREEN, IND TEMP, MRL A', indicating green (halogen-free) packaging and industrial temperature grade. REACH and conflict minerals status not stated in provided data.
